Laser soldering system using dynamic light spot and method thereof

A laser soldering system using dynamic light spot, comprising:

• a laser lens, comprising a first lens and a second lens;
• an electric displacement module, connected to at least one of the first lens and the second lens, the electric displacement module being controlled to move to adjust a lens distance between the first lens and the second lens;
• a laser module, used to radiate a laser beam toward the laser lens to form a light spot on a soldering target behind the laser lens;
• a control module, electrically connected to the laser module and the electric displacement module, the control module being configured to control the laser module to radiate, and control the electric displacement module to adjust the lens distance between the first lens and the second lens to adjust a light spot size of the light spot based on a spot-adjustment condition when the spot-adjustment condition is met in a soldering stage;
• and
• an image capture module, electrically connected to the control module, used to photograph the soldering target;
• and
• an extruding device, electrically connected to the control module, used to provide a soldering material to a pad of a printed circuit board to be the soldering target;
• wherein the control module comprises an image monitoring module, configured to receive a plurality of pre-soldering images of the soldering target in a continuous manner from the image capture module, and executes an automatic positioning procedure on the plurality of pre-soldering images to detect whether the soldering material arrives the soldering location;
• wherein the control module is configured to control the extruding device to move the soldering material to a soldering location of the pad based on a detection result of the image monitoring module.