Substrate liquid processing apparatus and liquid discharge evaluation method
AssigneeTokyo Electron Limited
InventorsTerufumi Wakiyama, Yuichi Douki, Akinori Tanaka, Minoru Tashiro, Reo Kitayama, Shu Yamamoto
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AssigneeTokyo Electron Limited
InventorsTerufumi Wakiyama, Yuichi Douki, Akinori Tanaka, Minoru Tashiro, Reo Kitayama, Shu Yamamoto
Estimating the term…
A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.
A substrate liquid processing apparatus, comprising:
A liquid discharge evaluation method, comprising:
Dependencies are inferred from the claim text.