Support assembly, unit, and light module for a motor vehicle lighting device, and method for manufacturing a unit

A unit comprising:

• at least one support assembly comprising a metallic heat sink and a plastic element with a receiving section to accommodate the electronic component, the plastic element being connected to the heat sink in a form-fit manner, the receiving section of the plastic element covering a heat input side of the heat sink, and the plastic element comprising a thermosetting plastic with fillers to increase a thermal conductivity;
• an electronic component having at least one electronic part;
• and
• a circuit board with a strip conductor system to electrically contact the at least one electronic part, the at least one electronic part being arranged on the circuit board, and the circuit board being connected to the plastic element in a form-fit manner.

A method for manufacturing a unit that includes a metallic heat sink, a plastic element with a receiving section to accommodate an electronic component, the plastic element being connected to the heat sink in a form-fit manner, the receiving section of the plastic element covering a heat input side of the heat sink, and the plastic element comprising a thermosetting plastic with fillers to increase a thermal conductivity, the unit further including an electronic component including at least one electronic part, and a strip conductor system for electrically contacting the at least one electronic part, the at least one electronic part and the strip conductor system being arranged on the receiving section of the plastic element, the method comprising:

• providing the metallic heat sink with the heat input side of the heat sink being provided with a microstructured surface with undercut microstructures;
• injection molding or hot pressing of a compound containing the thermosetting plastic with fillers for increasing the thermal conductivity to form the plastic element in a form-fit connection to the heat sink, the heat input side of the heat sink being covered by the receiving section of the plastic element;
• applying the strip conductor system to the receiving section of the plastic element via a molded interconnect device (MID) process, and
• applying the at least one electronic part to the receiving section of the plastic element to establish the electrical contact via the strip conductor system.

A method for manufacturing a unit that includes a metallic heat sink, a plastic element with a receiving section to accommodate an electronic component, the plastic element being connected to the heat sink in a form-fit manner, the receiving section of the plastic element covering a heat input side of the heat sink, and the plastic element comprising a thermosetting plastic with fillers to increase a thermal conductivity, the unit further including an electronic component having at least one electronic part and a circuit board with a strip conductor system to electrically contact the at least one electronic part, the at least one electronic part being arranged on the circuit board, and the circuit board being connected to the plastic element in a form-fit manner, the method comprising:

• providing the metallic heat sink, with the heat input side of the heat sink being provided with a microstructured surface, with undercut microstructures;
• providing the circuit board together with the strip conductor system, with a rear side of the circuit board being provided with a microstructured surface, with undercut microstructures;
• injection molding a compound containing a thermosetting plastic with fillers for increasing the thermal conductivity to form the plastic element in a form-fit connection to the heat sink and to the circuit board, the heat input side of the heat sink and the rear side of the circuit board being covered by the receiving section of the plastic element;
• and
• applying the at least one electronic part to the circuit board to establish the electrical contact via the strip conductor system.