Magnetron sputter device

A magnetron sputtering device comprising:

• a chamber having a vacuum state therein;
• a gas supply pipe configured to supply argon (Ar) gas into the chamber;
• a sputtering head provided within the chamber, and comprising a sputtering target and a magnetic body disposed on a bottom end of the sputtering target to generate a magnetic field;
• a power supply configured to supply current to the sputtering target to generate plasma;
• a cooling device comprising a refrigerant pipe, through which refrigerant circulating from outside the chamber to the sputtering head, flows, and configured to cool the sputtering head to a low temperature;
• and
• a sputtering shield surrounding an area of the refrigerant pipe located outside the chamber, and comprising a gas inlet communicating with the gas supply pipe, a refrigerant inlet and a refrigerant outlet communicating with the refrigerant pipe,
• wherein the sputtering shield includes a communication hole communicating with the chamber to have a vacuum state therein, and
• the refrigerant pipe delivers the refrigerant while being disposed in a dual vacuum structure, wherein in the dual vacuum structure,
• an area of the refrigerant pipe located outside the chamber is disposed within the sputtering shield having the vacuum state, and
• an area of the refrigerant pipe located between the sputtering shield and the sputtering head is disposed within the chamber having the vacuum state,
• wherein the gas supply pipe extends through the sputtering shield to connect the gas inlet to the sputtering head.