Combination RFID/EAS tags and methods of manufacture
AssigneeSML Intelligent Inventory Solutions LLC
InventorsYichang Liu, Mohammed Ramzan, Mark Anton Abraham
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Abstract
Disclosed are combination radio frequency identification (RFID) and electronic article surveillance (EAS) tags and methods of producing such tags. The claimed method is characterized by feeding a first plurality of first type inlays and a second plurality of second type inlays into a laminating machine, wherein each of the first and second type inlays are formed on first and second substrates, respectively; laminating the first type inlays to the second type inlays, thereby forming a plurality of pairs of the first and second type inlays, each of the pairs comprising an RFID inlay and an EAS inlay, wherein the RFID inlay and the EAS inlay of each pair are functionally independent.
Claims17
A method of producing combination radio frequency identification (RFID) and electronic article surveillance (EAS) tags, comprising the steps of:
- feeding a first plurality of first type inlays and a second plurality of second type inlays into a laminating machine, wherein each of said first and second type inlays are formed on first and second substrates, respectively;
- laminating said first type inlays to said second type inlays, thereby forming a plurality of pairs of said first and second type inlays physically isolated by at least one of said first and second substrates, each of said pairs comprising an RFID inlay and an EAS inlay, wherein said RFID inlay and said EAS inlay of each of said pairs are functionally independent.
A combination radio frequency identification (RFID) and electronic article surveillance (EAS) tag, comprising:
- a first substrate carrying an RFID inlay, said RFID inlay comprising an RFID antenna element and an integrated circuit coupled thereto;
- and,
- a second substrate carrying an EAS inlay, said EAS inlay comprising an EAS antenna element;
- wherein said first and second substrates are laminated together such that at least one of said first and second substrates physically isolates said RFID inlay from said EAS inlay, and wherein said RFID inlay is functionally independent from said EAS inlay.
Dependencies are inferred from the claim text.