Per channel thermal management techniques for stacked memory

A system comprising:

• a multi-chip device comprising:
• a stack of memory dies, each of the memory dies of the stack including a plurality of channels;
• and
• a logic die coupled with the stack of memory dies, the logic die including a memory controller, the memory controller including:
• circuitry to:
• receive channel temperature information to indicate a temperature of a channel of one of the memory dies of the stack,
• throttle row commands to the channel at a first rate based on the channel temperature information, and
• throttle column commands to the channel at a second rate based on the channel temperature information.

A method comprising:

• receiving channel temperature information from a plurality of stacked memory dies, the channel temperature information to indicate a temperature of a channel of a memory die of the plurality of stacked memory dies;
• throttling row commands to the channel at a first rate based on the channel temperature information;
• and
• throttling column commands to the channel at a second rate based on the channel temperature information.