Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
AssigneeResonac Corporation
InventorsAya Kasahara, Tomohiko Kotake, Daisuke Fujimoto
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Abstract
The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.
Claims19
A maleimide resin composition comprising
- (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a polyaminobismaleimide compound having a structural unit derived from the maleimide compound and a structural unit derived from a diamine compound;
- and
- (B) a modified conjugated diene polymer,
- the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups,
- wherein a content ratio the component (A) to the component (B) [(A)/(B)] is 2.2 to 5.0 on a mass basis.
Dependencies are inferred from the claim text.