# US 12,262,468 B2 · Copper-clad laminate and method of forming the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,262,468 B2 - Document ID: US12262468B2 - Status: Granted - Kind: B2 - Application number: 17/443,386 - Filed: 2021-07-26 - Published: 2022-02-03 - Granted: 2025-03-25 - Earliest claimed: 2020-07-28 - Assignees: Versiv Composites Limited - Applicants: Versiv Composites Limited - Inventors: Jennifer Adamchuk; Gerard T. Buss; Theresa M. Besozzi - Web page: https://patentgrep.com/patent/US12262468B2 ## CPC - C09D 7/61: inorganic - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - C09D 5/24: Electrically-conducting paints {(conductive materials H01B1/00)} - C09D 7/69: {Particle size larger than 1000 nm} - C09D 127/12: containing fluorine atoms - C09D 127/18: Homopolymers or copolymers of tetrafluoroethene - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} - H05K 3/44: Manufacturing insulated metal core circuits {or other insulated electrically conductive core circuits (H05K3/0058, H05K3/4608, and H05K3/4641 take precedence)} - C08K 3/34: Silicon-containing compounds - C08K 3/36: Silica - C08K 2201/005: Additives being defined by their particle size in general - C08K 2201/006: Additives being defined by their surface area - H05K 2201/0355: Metal foils - H05K 2201/0358: Resin coated copper [RCC] - H05K 2201/068: wherein the coefficient of thermal expansion is important - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns. ## Claims ### Claim 1 A copper-clad laminate comprising: a copper foil layer, and a dielectric coating overlying the copper foil layer, wherein the dielectric coating comprises: a resin matrix component; and a ceramic filler component, wherein the ceramic filler component comprises a first filler material wherein the content of the ceramic filler component is at least 30 vol. % for a total volume of the dielectric coating, wherein the dielectric coating has an average thickness of not greater than about 20 microns, and wherein the first filler material comprises silica and has a D50 particle size distribution of at least about 0.5 microns and not greater than about 2.7 microns, and wherein the dielectric coating has a porosity of not greater than about 8 vol. %. ### Claim 2 (depends on 1) The copper-clad laminate of claim 1, wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns. ### Claim 3 (depends on 1) The copper-clad laminate of claim 1, wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D90-D10)/D50, where D90 is equal to a D90 particle size distribution measurement of the first filler material, D10 is equal to a D10 particle size distribution measurement of the first filler material, and D50 is equal to a D50 particle size distribution measurement of the first filler material. ### Claim 4 (depends on 1) The copper-clad laminate of claim 1, wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g. ### Claim 5 (depends on 1) The copper-clad laminate of claim 1, wherein the first filler material comprises a silica based compound. ### Claim 6 (depends on 1) The copper-clad laminate of claim 1, wherein the resin matrix comprises a perfluoropolymer. ### Claim 7 (depends on 6) The copper-clad laminate of claim 6, wherein the perfluoropolymer comprises a copolymer of tetrafluoroethylene (TFE); a copolymer of hexafluoropropylene (HFP); a terpolymer of tetrafluoroethylene (TFE); polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. ### Claim 8 (depends on 1) The copper-clad laminate of claim 1, wherein the content of the resin matrix component is at least about 50 vol. % and not greater than about 63 vol. % for a total volume of the dielectric coating. ### Claim 9 (depends on 1) The copper-clad laminate of claim 1, wherein the content of the ceramic filler component is not greater than about 57 vol. % for a total volume of the dielectric coating. ### Claim 10 (depends on 1) The copper-clad laminate of claim 1, wherein the content of the first filler material is at least about 80 vol. % and not greater than about 100 vol. % for a total volume of the ceramic filler component. ### Claim 11 (depends on 1) The copper-clad laminate of claim 1, wherein the dielectric coating comprises a dissipation factor (5 GHz, 20% RH) of not greater than about 0.005. ### Claim 12 (depends on 1) The copper-clad laminate of claim 1, wherein the dielectric coating comprises a coefficient of thermal expansion (all axes) of not greater than about 80 ppm/° C. ### Claim 13 (depends on 1) The copper-clad laminate of claim 1, wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in. ### Claim 14 A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises: a copper foil layer, and a dielectric coating overlying the copper foil layer, wherein the dielectric coating comprises: a resin matrix component; and a ceramic filler component, wherein the ceramic filler component comprises a first filler material wherein the content of the ceramic filler component is at least 30 vol. % for a total volume of the dielectric coating, and wherein the dielectric coating has an average thickness of not greater than 20 microns, and wherein the first filler material comprises silica and has a D50 particle size distribution of at least about 0.5 microns and not greater than about 2.7 microns, and wherein the dielectric coating has a porosity of not greater than about 8 vol. %. ### Claim 15 (depends on 14) The printed circuit board of claim 14, wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns. ### Claim 16 (depends on 14) The printed circuit board of claim 14, wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D90-D10)/D50, where D90 is equal to a D90 particle size distribution measurement of the first filler material, D10 is equal to a D10 particle size distribution measurement of the first filler material, and D50 is equal to a D50 particle size distribution measurement of the first filler material. ### Claim 17 (depends on 14) The printed circuit board of claim 14, wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g. ### Claim 18 (depends on 14) The printed circuit board of claim 14, wherein the first filler material comprises a silica based compound. ### Claim 19 A method of forming a copper-clad laminate, wherein the method comprises: providing a copper foil layer, combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture, forming the forming mixture into a dielectric coating overlying the copper foil, wherein the dielectric coating has an average thickness of not greater than about 20 microns wherein the ceramic filler precursor component comprises a first filler material wherein the content of the ceramic filler component is at least 30 vol. % for a total volume of the dielectric coating, wherein the first filler material comprises silica and has a D50 particle size distribution of at least about 0.5 microns and not greater than about 2.7 microns, and wherein the dielectric coating has a porosity of not greater than about 8 vol. %.