Vertically stacked light sensors
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsiang-Lin Chen, Yi-Shin Chu, Yin-Kai Liao, Sin-Yi Jiang, Sung-Wen Huang Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsiang-Lin Chen, Yi-Shin Chu, Yin-Kai Liao, Sin-Yi Jiang, Sung-Wen Huang Chen
Estimating the term…
Various embodiments of the present disclosure are directed towards a semiconductor structure including a first substrate comprising a first semiconductor material. A first light sensor is disposed within the first substrate. The first light sensor is configured to absorb electromagnetic radiation within a first wavelength range. A second light sensor is disposed within an absorption structure underlying the first substrate. The second light sensor is configured to absorb electromagnetic radiation within a second wavelength range different from the first wavelength range. The absorption structure underlies the first light sensor and comprises a second semiconductor material different from the first semiconductor material.
A semiconductor structure, comprising:
A stacked integrated chip (IC) structure, comprising:
A method for forming a stacked integrated chip (IC) structure, comprising:
Dependencies are inferred from the claim text.