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US 12,261,062 B2Granted
Spot heating by moving a beam with horizontal rotary motion
AssigneeApplied Materials, Inc.
InventorsShu-Kwan Danny Lau, Toshiyuki Nakagawa, Zhiyuan Ye
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Abstract
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.
Claims16
A process chamber, comprising:
- a first window;
- a second window;
- a substrate support disposed between the first window and the second window,
- the substrate support configured to support a substrate;
- a rotary stage disposed in a first plane above the first window;
- and
- a rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window, such that the rotatable radiant spot heating source is mounted to the rotary stage and positioned at an acute angle with respect to the first plane, wherein the rotary stage is rotatable to rotate the rotatable radiant spot heating source about a rotational axis orthogonal to the first plane, the rotatable radiant spot heating source configured to direct the radiant energy toward the substrate supported on the substrate support in a sweeping motion at least partially along an arcuate path, the arcuate path extending from a center of the substrate to a circumference of the substrate.
4 more elements
A process chamber, comprising:
- a first window;
- a substrate support disposed proximate the first window, the substrate support configured to support a substrate;
- a rotary stage disposed in a first plane;
- and
- a rotatable radiant spot heating source mounted to the rotary stage and configured to provide radiant energy through the first window toward the substrate support, the rotatable radiant spot heating source positioned at an acute angle with respect to the first plane, wherein the rotary stage is rotatable to rotate the rotatable radiant spot heating source about a rotational axis orthogonal to the first plane,
- the rotatable radiant spot heating source configured to direct the radiant energy to the substrate supported on the substrate support in a sweeping motion at least partially along an arcuate path, the arcuate path extending from a center of the substrate to a circumference of the substrate.
3 more elements
Dependencies are inferred from the claim text.