Test device and probe polishing method

A test device configured to test a substrate under test, comprising:

• a mounting table for test on which the substrate under test is mounted;
• a transportation mechanism configured to transport at least the substrate under test;
• a mounting table for polishing on which a polishing substrate, the polishing substrate being a member configured to polish a probe coming into contact with a substrate during its test and has a shape and size transportable by the transportation mechanism, is mounted;
• a first forward or backward movement mechanism configured to move the mounting table for test forward or backward with respect to the probe;
• a second forward or backward movement mechanism configured to move the mounting table for polishing forward or backward with respect to the probe;
• and
• a rotating mechanism configured to rotate the mounting table for polishing,
• wherein the mounting table for polishing is provided separately from the mounting table for test,
• wherein a retreat region of the mounting table for test is at a position opposite to a retreat region of the mounting table for polishing, with the probe interposed therebetween in a plan view, and
• wherein the second forward or backward movement mechanism is configured such that a portion of the polishing substrate, mounted on the mounting table for polishing, on a front side, which is an opposite side to a retreat region of the polishing substrate, overlaps the probe in a plan view while a portion of the polishing substrate on an inner side, which is the retreat region of the polishing substrate, does not overlap the probe in a plan view, and
• wherein, by the rotating mechanism and the second forward or backward movement mechanism, a region of the polishing substrate mounted on the mounting table, that was the inner side and could not be overlapped with the probe in a plan view, is overlapped with the probe in a plan view as a region of the front side.