Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate
AssigneeInternational Business Machines Corporation
InventorsMuir Kumph, Vivekananda P. Adiga
Life of this patent
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Abstract
A microelectromechanical system (MEMS) device and method of fabrication are provided. The MEMS devices includes a silicon substrate. The silicon substrate includes a top surface. An interconnect is machined from the silicon substrate. The interconnect includes at a spring body that has least two spring arms. Each spring arm includes a first end distal from a center of the interconnect, a second end proximate the center of the interconnect, and a single turn of a constant curvature. Each spring arm is configured to move rotationally in a plane parallel to the top surface of the silicon substrate.
Claims20
A microelectromechanical system (MEMS) device, comprising:
- a silicon substrate having a top surface;
- an interconnect machined from the silicon substrate, wherein:
- the interconnect includes a spring body,
- the spring body includes two or more spring arms, wherein each spring arm includes:
- a first end distal from a center of the interconnect;
- a second end proximate the center of the interconnect;
- and
- one or more silicon bumps on the center of the interconnect configured to make vertical physical contact with a connection point on another device, wherein the spring body is configured to provide vertical leeway in a direction of the physical contact.
A quantum computing device, comprising:
- a transmon qubit circuit;
- and
- a microelectromechanical system (MEMS) device, including:
- a silicon substrate having a top surface;
- an interconnect machined from the silicon substrate, wherein the interconnect includes a spring body,
- the spring body includes two or more spring arms, wherein each spring arm includes:
- a first end distal from a center of the interconnect;
- a second end proximate the center of the interconnect;
- and
- one or more silicon bumps on the center of the interconnect configured to make vertical physical contact with a connection point on another device, wherein the spring body is configured to provide vertical leeway in a direction of the physical contact.
A method of manufacturing a microelectromechanical system (MEMS) device, comprising:
- controllably removing silicon from a silicon substrate, wherein one or more silicon features remain on the silicon substrate;
- masking the silicon substrate and the one or more silicon features;
- and
- selectively removing silicon from the silicon substrate based on a mask pattern defined by the masking step, wherein:
- the mask pattern defines an interconnect including a spring body wherein the spring body includes at least two spring arms;
- and
- each spring arm includes a first end distal from a center of the interconnect, a second end proximate the center of the interconnect, and one or more silicon bumps on the center of the interconnect configured to make vertical physical contact with a connection point on another device, wherein the spring body is configured to provide vertical leeway in a direction of the physical contact.
Dependencies are inferred from the claim text.