Apparatus for cooling electronic circuitry components and photonic components
AssigneeNokia Technologies Oy
InventorsRaffaele Luca Amalfi, Stefano Grillanda, Ryan Enright
Life of this patent
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Abstract
An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.
Claims16
An apparatus comprising:
- at least one electronic circuitry component;
- at least one photonic component, wherein the at least one photonic component is positioned overlaying the at least one electronic circuitry component;
- at least one electrical connection between the at least one electronic circuitry component and the at least one photonic component, wherein the at least one electrical connection is less than 300 micrometers;
- at least one spacer spacing the at least one electronic circuitry component and the at least one photonic component, wherein the at least one spacer is thermally insulating, and wherein the at least one spacer comprises aerogel;
- at least one first heat transfer configured to remove heat from the at least one electronic circuitry component;
- and
- at least one second heat transfer configured to remove heat from the at least one photonic component.
An apparatus comprising:
- at least one electronic circuitry component;
- at least one photonic component;
- at least one electrical connection between the at least one electronic circuitry component and the at least one photonic component, wherein the at least one electrical connection is less than 300 micrometers;
- at least one spacer located between an inner side of the at least one electronic circuitry component and an inner side of the at least one photonic component, wherein the at least one spacer is thermally insulating, wherein the at least one spacer comprises aerogel;
- a first heat transfer member connected to the at least one electronic circuitry component at an outer side of the at least one electronic circuitry component, where the first heat transfer member is configured to remove heat from the at least one electronic circuitry component;
- and
- a second heat transfer member connected to the at least one photonic component at an outer side of the at least one photonic component, where the second heat transfer member is configured to remove heat from the at least one photonic component, and where the second heat transfer member is spaced from the first heat transfer member.
Dependencies are inferred from the claim text.