Copper halide layers
AssigneePresident and Fellows of Harvard College
InventorsChristina M. Chang, Luke M. Davis, Roy Gerald Gordon
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Abstract
Articles are described including a substrate and a copper halide layer on the substrate, where the interfacial free energy between the substrate and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer conforms to the shape of the substrate. The articles may further include an adhesion layer disposed in-between the substrate and the copper halide layer, where the surface free energy between the adhesion layer and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer or the adhesion layer conform to the shape of the substrate. Also described are methods of forming an article using chemical vapor deposition.
Claims36
An article comprising:
- a substrate;
- and
- a copper halide layer on the substrate;
- wherein the interfacial free energy between the substrate and the copper halide layer is configured such that:
- the copper halide layer is free of discontinuations of sizes of about 5 nm2 or greater;
- and
- the copper halide layer conforms to the shape of the substrate.
A method of fabricating an article, comprising:
- providing a substrate;
- and
- depositing a copper halide layer on the substrate using a chemical vapor deposition process;
- wherein the interfacial free energy between the substrate and the copper halide layer allows the copper halide layer to form free of discontinuations of sizes of about 5 nm2 or greater;
- and
- wherein the copper halide layer conforms to the shape of the substrate.
Dependencies are inferred from the claim text.