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US 12,252,634 B2Granted
Polyurethane for polishing layers, polishing layer and polishing pad
AssigneeKuraray Co., Ltd.
InventorsMitsuru Kato, Chihiro Okamoto, Shinya Kato
Life of this patent
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Abstract
Disclosed are a polyurethane for use in a polishing layer, and a polishing layer and a polishing pad using the same, the polyurethane including a terminal group represented by the following formula (I): R—(OX)n— (I) wherein R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that may be substituted with a heteroatom or may be interrupted by a heteroatom, X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and n represents a number from 8 to 120.
Claims14
A polishing layer that is a molded body of a polyurethane comprising:
- a terminal group represented by formula (I):
- R—(OX)n— (I)
- wherein
- R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that are optionally substituted with a heteroatom or are optionally interrupted by a heteroatom,
- X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and
- n represents a number from 8 to 120.
3 more elements
Dependencies are inferred from the claim text.