Polishing liquid and method for manufacturing glass substrate
AssigneeHoya Corporation
InventorToshio Takizawa
Life of this patent
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Abstract
Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, D100 is 3 μm or more, D50 is 0.8 to 2.4 μm, and Dpeak−D5 is less than D95−Dpeak.
Claims16
A polishing liquid that contains cerium oxide as loose abrasive particles and is to be used in polishing processing for polishing a surface of a glass substrate,
- wherein, letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of a total particle volume in a particle size distribution obtained regarding the cerium oxide using a laser diffraction/scattering method,
- D5 is 1 μm or less,
- a difference between D95 and the D5 is 3 μm or more,
- D50 is 0.8 to 2.4 μm, and
- Dpeak−D5 is less than D95−Dpeak, where the Dpeak is a particle diameter at which a frequency is at a maximum in the particle size distribution.
A polishing liquid that contains cerium oxide as loose abrasive particles and is to be used in polishing processing for polishing a surface of a glass substrate,
- wherein, letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of a total particle volume in a particle size distribution obtained regarding the cerium oxide using a laser diffraction/scattering method,
- D5 is 1 μm or less,
- a difference between D95 and the D5 is 3 μm or more, and
- Dpeak−D5 is less than D95−Dpeak, where the Dpeak is a particle diameter at which a frequency is at a maximum in the particle size distribution.
A polishing liquid that contains cerium oxide as loose abrasive particles and is to be used in polishing processing for polishing a surface of a glass substrate,
- wherein, letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of a total particle volume in a particle size distribution obtained regarding the cerium oxide using a laser diffraction/scattering method,
- D5 is 1 μm or less,
- a difference between D95 and the D5 is 3 μm or more,
- D50 is 0.8 to 2.4 μm, and
- Dpeak is 3 μm or less, where the Dpeak is a particle diameter at which a frequency is at a maximum in the particle size distribution.
Dependencies are inferred from the claim text.