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US 12,251,936 B2Granted
MEMS device, liquid ejecting head, and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorsMotoki Takabe, Yu Shiozawa
Life of this patent
Estimating the term…
Abstract
A MEMS device includes a first substrate 22 including a single-crystal silicon substrate and a second substrate 23 including a single-crystal silicon substrate, in which the first substrate 22 and the second substrate 23 are laminated together, and the first substrate 22 and the second substrate 23 are joined to each other such that the cleavage directions of both substrates intersect each other.
Claims14
A MEMS device comprising:
- a first substrate including a single-crystal silicon substrate;
- and
- a second substrate including a single-crystal silicon substrate, the first substrate and the second substrate being laminated together, wherein
- the first substrate and the second substrate are joined to each other such that a cleavage direction of the first substrate intersects a cleavage direction of the second substrate in a plan view;
- and
- the cleavage directions of the first substrate and the second substrate are along cleavage surfaces of the single-crystal silicon substrates that are arranged orthogonal to a crystal plane of a surface of each of the first substrate and the second substrate in the plan view.
3 more elements
A MEMS device comprising:
- a first substrate including a single-crystal silicon substrate;
- and
- a second substrate including a single-crystal silicon substrate, the first substrate and the second substrate being laminated together, wherein
- the first substrate and the second substrate are joined to each other such that a cleavage direction of the first substrate intersects a cleavage direction of the second substrate,
- the first substrate includes a single-crystal silicon substrate having a first surface orientation and the second substrate includes a single-crystal silicon substrate having a second surface orientation that is identical to the first surface orientation
- the first substrate includes a single-crystal silicon substrate having a surface orientation of {100} and the second substrate includes a single-crystal silicon substrate having a surface orientation of {100}, and
- an intersection angle at which the cleavage direction of the first substrate intersects the cleavage direction of the second substrate is from 10° to 80°.
4 more elements
Dependencies are inferred from the claim text.