# US 12,250,767 B2 · Dielectric substrate and method of forming the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,250,767 B2 - Document ID: US12250767B2 - Status: Granted - Kind: B2 - Application number: 18/471,816 - Filed: 2023-09-21 - Published: 2024-01-18 - Granted: 2025-03-11 - Earliest claimed: 2020-07-28 - Assignees: Versiv Composites Limited - Applicants: Versiv Composites Limited - Inventors: Jennifer Adamchuk; Gerard T. Buss; Theresa M. Besozzi - Web page: https://patentgrep.com/patent/US12250767B2 ## CPC - H05K 1/036: {Multilayers with layers of different types} - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H05K 1/05: Insulated {conductive substrates, e.g. insulated} metal substrate - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/0346: {containing N} - H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive} - H05K 2201/015: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] - H05K 2201/0154: Polyimide - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/0266: Size distribution - H05K 2201/0358: Resin coated copper [RCC] - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns. ## Claims ### Claim 1 A dielectric substrate comprising: a polyimide layer and a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component; and a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g. ### Claim 2 (depends on 1) The dielectric substrate of claim 1, wherein the first filler material comprises a silica-based compound. ### Claim 3 (depends on 1) The dielectric substrate of claim 1, wherein the first resin matrix component comprises a perfluoropolymer. ### Claim 4 (depends on 1) The dielectric substrate of claim 1, wherein the content of the first resin matrix component is at least about 45 vol. % and not greater than about 63 vol. % for a total volume of the first filled polymer layer. ### Claim 5 (depends on 1) The dielectric substrate of claim 1, wherein the content of the first ceramic filler component is at least about 30 vol. % and not greater than about 57 vol. % for a total volume of the first filled polymer layer. ### Claim 6 (depends on 1) The dielectric substrate of claim 1, wherein the content of the first filler material is at least about 80 vol. % and not greater than about 100 vol. % for a total volume of the first ceramic filler component. ### Claim 7 (depends on 1) The dielectric substrate of claim 1, wherein the first ceramic filler component further comprises a second filler material. ### Claim 8 (depends on 7) The dielectric substrate of claim 7, wherein the second filler material of the first ceramic filler component comprises a high dielectric constant ceramic material. ### Claim 9 (depends on 7) The dielectric substrate of claim 7, wherein a particle size distribution of the silica filler material of the second ceramic filler component comprises a D10 of at least about 0.2 microns and not greater than about 1.6. ### Claim 10 (depends on 7) The dielectric substrate of claim 7, wherein the second filler material comprises a silica-based compound. ### Claim 11 (depends on 1) The dielectric substrate of claim 1, wherein the dielectric substrate further comprises a second filled polymer layer underlying the polyimide layer, wherein the second filled polymer layer comprises a second resin matrix component; and a second ceramic filler component, wherein the second ceramic filler component comprises a silica filler material, wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g. ### Claim 12 (depends on 1) The dielectric substrate of claim 1, wherein the dielectric substrate comprises a dissipation factor (5 GHZ, 20% RH) of not greater than about 0.005. ### Claim 13 (depends on 1) The dielectric substrate of claim 1, wherein the dielectric substrate comprises a porosity of not greater than about 10 vol. %. ### Claim 14 A copper-clad laminate comprising a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises: a polyimide layer and a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component; and a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, and wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g. ### Claim 15 (depends on 14) The copper-clad laminate of claim 14, wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric substrate of at least about 6 lb/in. ### Claim 16 (depends on 14) The copper-clad laminate of claim 14, wherein the copper-clad laminate comprises a porosity of not greater than about 10 vol. %. ### Claim 17 A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises: a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises: a polyimide layer and a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component; and a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, and wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g. ### Claim 18 (depends on 17) The printed circuit board of claim 17, wherein the printed circuit board comprises a peel strength between the copper foil layer and the dielectric substrate of at least about 5 lb/in. ### Claim 19 (depends on 17) The printed circuit board of claim 17, wherein the printed circuit board comprises a porosity of not greater than about 10 vol. %. ### Claim 20 (depends on 17) The printed circuit board of claim 17, wherein the silica filler material of the first ceramic filler component comprises a particle size distribution span (PSDS) of not greater than about 8, where PSDS is equal to (D90−D10)/D50, where D90 is equal to a D90 particle size distribution measurement of the silica filler material, D10 is equal to a D10 particle size distribution measurement of the first filler material, and D50 is equal to a D50 particle size distribution measurement of the first filler material. ### Claim 21 (depends on 17) The printed circuit board of claim 17, wherein the dielectric substrate comprises a dissipation factor (5 GHz, 20% RH) of not greater than about 0.005.