An ohmically resistive coating, comprising a layer deposited on a surface of a substrate via at least one of cold spray and solid state deposition, the layer having a thickness of 2 to 300 microns and includes:
- at least 30% by weight of at least one ductile or malleable metal selected from a group including:
- copper, aluminium, zinc, and manganese;
- a plurality of electrically resistive particles that include at least one of compounds and salts of at least one of a metal and a metalloid;
- wherein the at least one ductile or malleable metal bonds the plurality of electrically resistive particles to the surface of the substrate to form the ohmically resistive coating;
- wherein the ohmically resistive coating is formed via the at least one of the cold spray and the solid state deposition performed at a temperature below at least one of a melting temperature and a partially softening temperature of the at least one ductile or malleable metal;
- wherein the ohmically resistive coating exhibits less heterogeneity and porosity than a thermally sprayed coating, has a density of 90% or greater, and has a porosity of 10% or less;
- wherein the plurality of electrically resistive particles are embedded in the at least one ductile or malleable metal.