Microelectronic assemblies having integrated magnetic core inductors

A microelectronic assembly, comprising:

• a first die having a first surface and an opposing second surface in a first dielectric layer;
• a magnetic core inductor, having a first surface and an opposing second surface, in the first dielectric layer, wherein the magnetic core inductor includes:
• a first conductive pillar, having a first end at the first surface of the magnetic core inductor and an opposing second end at the second surface of the magnetic core inductor, at least partially surrounded by a magnetic material that extends at least partially along a thickness of the first conductive pillar from the second end and tapers towards the first end;
• and
• a second conductive pillar, having a first end at the first surface of the magnetic core inductor and an opposing second end at the second surface of the magnetic core inductor, coupled to the first conductive pillar;
• and
• a second die having a first surface and an opposing second surface, in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the first surface of the second die is coupled to the second surface of the magnetic core inductor.