Metal foil with carrier
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsYukiko Kitabatake, Masahiro Koide, Rintaro Ishii, Yoshinori Matsuura
Life of this patent
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Abstract
Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.
Claims10
A carrier-attached metal foil comprising:
- a carrier;
- a release functional layer provided on the carrier, the release functional layer including a metal oxynitride;
- and
- a metal layer provided on the release functional layer;
- wherein the release functional layer includes:
- an adhesion layer provided on the carrier, the adhesion layer containing at least one selected from the group consisting of Cu, Ti, Ta, Cr, Ni, Al, Mo, Zn, W, TiN, and TaN, and
- a release layer provided on the adhesion layer, the release layer containing at least one metal oxynitride selected from the group consisting of TaON, NiON, TiON, NiWON, and MoON.
Dependencies are inferred from the claim text.