Copper powder, method for manufacturing copper powder, and method for manufacturing solid shaped object
AssigneeJX Advanced Metals Corporation
InventorsYosuke Endo, Hiroyoshi Yamamoto, Ryo Suzuki, Kenji Sato
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Abstract
The present invention provides a copper powder which is capable of fusion bonding with a low energy laser by enabling heat to be efficiently inputted with a high absorption rate for laser irradiation and has high convenience in handling, and provides a method for manufacturing the copper powder. One embodiment of the present invention is a copper powder, having an absorption rate for light having a wavelength λ=1060 nm of 18.9% to 65.0%, and an index, which is indicated by (the absorption rate for light having a wavelength λ=1060 nm)/(an oxygen concentration), of 3.0 or more.
Claims18
A copper powder consisting of copper and inevitable impurities, the copper powder having an outer surface, and an oxide coating formed on the entire outer surface of the powder, and an absorption rate for light having a wavelength λ=1060 nm of 18.9% to 65.0%, and an index, which is indicated by (the absorption rate percentage (%) for light having a wavelength λ=1060 nm/an oxygen concentration (wtppm))*100, of 3.0 or more.
Dependencies are inferred from the claim text.