Electronic component module, and method of manufacturing the same

An electronic component module comprising:

• a module substrate including a ground electrode layer;
• an exposed component and a sealing component, the exposed component and the sealing component being mounted on at least one surface of the module substrate;
• a sealing resin covering the at least one surface of the module substrate and the sealing component;
• a shield layer provided on a top surface and a side surface of the sealing resin and a side surface of the module substrate, and electrically connected to the ground electrode layer;
• and
• a side wall portion surrounding a periphery of the exposed component and having conductivity to be electrically connected to the shield layer, wherein:
• the side wall portion includes at least one protruding portion at an upper end portion of the side wall portion, the at least one protruding portion protruding toward an interior space surrounded by the side wall portion, and including a tip forming a polygon having a predetermined area;
• and
• the shield layer is provided so as to cover an outer surface of the protruding portion.