Method and structure to control the solder thickness for double sided cooling power module

A method for manufacturing a power module, the method comprising:

• bonding at least one wire having a convex portion which is convex upward to a bonding region of an upper surface of a first metal layer of a first substrate having the first metal layer;
• manufacturing a first portion by disposing a spacer on the bonding region to be in contact with the convex portion and soldering the spacer and the first metal layer and a second portion by soldering one surface of a power semiconductor chip on a lower surface of a second metal layer of a second substrate having the second metal layer;
• disposing the first portion and the second portion between upper and lower jigs so that an upper surface of the spacer and a lower surface of the power semiconductor chip face each other while soldering the upper surface of the spacer and the lower surface of the power semiconductor chip and adjusting a distance between the upper and lower jigs to correspond to a predetermined height of the power module;
• and
• disposing a metal ball on the upper surface of the spacer, and applying a solder on the metal ball so that a minimum height of the solder is secured by the metal ball as much as a thickness of the metal ball while the solder is melting.