Manufacturing method of resistor and resistor
AssigneeKoa Corporation
InventorsYohei Tokiwa, Kohji Eto, Tomofumi Noguchi, Reina Kaneko
Life of this patent
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Abstract
A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.
Claims5
A manufacturing method of a resistor comprising:
- a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in a stacked direction;
- a step of passing the resistor base material through a die by using a drawing method, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material;
- and
- a step of obtaining an individual resistor from the resistor base material passed through the die, wherein
- the opening portion has a rectangular shape,
- a part of one side of the rectangular shape of the opening portion has protuding shape towards a center of opening,
- the protruding shape makes a groove in the resistor base material, and
- the resistor base material is out from a one surface side of the resistor base material in which the groove is formed towards an opposite face side of the one surface.
A resistor mounted on a circuit board, the resistor comprising:
- a resistive material having a square shape;
- a first electrode material bonded to a first end surface of the resistive material;
- and
- a second electrode material bonded to a second end surface of the resistive material, wherein a surface of the resistor is formed with stripe-patterned grooves and ridges extending in a direction orthogonal to a bonding direction in which the first electrode material, the resistive material, and the second electrode material are arranged side by side, and
- a mounting surface for the circuit board, an opposite surface relative to the mounting surface, an opposite surface relative to a surface of the first electrode material bonded to the resistive material, and an opposite surface relative to a surface of the second electrode material bonded to the resistive material respectively stripe-patterned grooves and ridges, the strip-patterned grooves and ridges extending in the direction orthogonal to the bonding direction.
Dependencies are inferred from the claim text.