Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures

A system comprising:

• a package substrate comprising a power plane structure;
• and
• a stacked die apparatus connected to the package substrate, the stacked die apparatus comprising:
• a first die comprising voltage regulator circuitry, the voltage regulator circuitry comprising circuitry to receive an input from the package substrate and provide an output based on the input;
• a second die comprising logic circuitry;
• a conformal power delivery structure on a surface of the stacked die apparatus opposite the package substrate, the conformal power delivery structure comprising:
• a first electrically conductive layer comprising metal, the first electrically conductive layer defining one or more recesses;
• a second electrically conductive layer comprising metal, the second electrically conductive layer at least partially within the recesses of the first electrically conductive layer and having a lower surface that generally conforms with the upper surface of the first electrically conductive layer;
• and
• a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another;
• an inductor connected to the output voltage regulator circuitry;
• a capacitor connected to the inductor and the logic circuitry of the second die;
• and
• a thermal interface material layer on the conformal power delivery structure of the stacked die apparatus;
• and
• a heat sink on the thermal interface material;
• wherein the conformal power delivery structure connected to at least one of the voltage regulator circuitry, the inductor, the capacitor, and the logic circuitry.