Heat transfer element
AssigneeAnalog Devices, Inc.
InventorsMarc T. Dunham, Baoxing Chen
Life of this patent
Estimating the term…
Abstract
A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.
Claims7
A heat transfer element configured to be directly contacted to a metal surface of an element, the heat transfer element comprising:
- a chamber defined at least in part by a housing having an electrically non-conductive frame and a metal portion,
- wherein the non-conductive frame comprises a base and a sidewall extending downwardly from the base, and
- wherein the metal portion has a first side and a second side and is positioned between the element and the chamber and between the element and the sidewall of the electrically non-conductive frame, the metal portion separating the element and the chamber,
- wherein the sidewall of the housing extends directly and upwardly from the first side of the metal portion and is disposed above the element;
- and
- a phase change material disposed in the chamber, the phase change material being in thermal communication with the first side of the metal portion,
- wherein the metal portion comprises at least two electrically reactive, alloy forming metals configured to, when the metal surface and the metal portion are brought into contact and an electrical current is applied, form an alloy and bond with the metal surface of the element.
Dependencies are inferred from the claim text.