Unsupported top hat layers in printhead dies
AssigneeHewlett-Packard Development Company, L.P.
InventorsVincent C. Korthuis, Huyen Pham, Tsuyoshi Yamashita
Life of this patent
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Abstract
In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.
Claims20
A printhead die comprising:
- a substrate;
- a chamber layer on the substrate;
- and
- a top hat layer on the chamber layer, the top hat layer comprising an initial unsupported top hat layer portion comprising a first end that is narrower than a second end.
A printhead die comprising:
- a substrate;
- and
- a plurality of slotted portions on the substrate, each of the plurality of slotted portions comprising:
- a chamber layer on the substrate;
- and
- a top hat layer on the chamber layer, the top hat layer comprising an initial unsupported top hat layer portion comprising a first end that is narrower than a second end.
A method for fabricating a printhead die, the method comprising:
- providing a substrate;
- depositing a first layer of a photo definable polymer on the substrate for defining a chamber layer;
- depositing a second layer of the photo definable polymer over the first layer for defining a top hat layer;
- and
- defining an initial unsupported top hat layer portion of the top hat layer, the initial unsupported top hat layer portion comprising a first end that is narrower than a second end.
Dependencies are inferred from the claim text.