Mitigating defects in an electrochromic device under a bus bar
AssigneesView Operating Corporation, Corning Incorporated
InventorsRonald M. Parker, Anshu Ajit Pradhan, Abhishek Anant Dixit, Douglas Samuel Dauson
Life of this patent
Estimating the term…
Abstract
Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.
Claims13
A method of manufacturing an electrochromic device comprising an electrochromic stack between a first and a second transparent electronically conductive layer configured to deliver potential over surfaces of the electrochromic stack and thereby cause optical switching of the electrochromic device, the method of manufacturing comprising:
- (a) fabricating the electrochromic stack on a glass substrate without pre-patterning in a first facility;
- (b) shipping the glass substrate including the electrochromic stack to a second facility;
- and
- (c) performing post-processing in the second facility,
- wherein a protective layer is deposited over the second transparent electronically conductive layer and the electrochromic stack in the first facility, wherein the protective layer is a hermetic top coat,
- wherein (c) comprises removing the deposited protective layer.
Dependencies are inferred from the claim text.