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US 12,237,296 B2Granted
System for laser bonding of flip chip
AssigneeProtec Co., Ltd.
InventorsYoun Sung Ko, Geunsik Ahn
Life of this patent
Estimating the term…
Abstract
A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.
Claims15
A system for laser bonding of flip chip comprising:
- a supply unit configured to supply a substrate, on which a plurality of semiconductor chips to be bonded to an upper surface of the substrate are arranged;
- a fixing unit configured to receive the substrate from the supply unit and fix a lower surface of the substrate;
- a laser unit comprising a laser head for bonding the semiconductor chips to the substrate by irradiating a laser beam to the substrate fixed to the fixing unit and a laser transporting portion transporting the laser head;
- a mask comprising a transmitting portion configured to transmit through a laser beam irradiated from the laser head of the laser unit and transmit through infrared rays including a wavelength band from about 3 μm or more to about 9 μm or less;
- a mask holding unit configured to hold the mask above the fixing unit;
- a pressurizing unit configured to lift one of the mask holding unit and the fixing unit relative to the other such that the transmitting portion of the mask pressurizes a plurality of semiconductor chips of the substrate fixed to the fixing unit;
- a discharging unit configured to receive the substrate from the fixing unit and discharge the substrate;
- an infrared camera configured to capture an image of the semiconductor chips to which a laser beam is irradiated by the laser head of the laser unit;
- and
- a controller configured to control operation of the supply unit, the fixing unit, and the discharging unit, and control operation of the laser head of the laser unit by using a value measured by the infrared camera.
7 more elements
A system for laser bonding of flip chip comprising:
- a supply unit configured to supply a substrate, on which a plurality of semiconductor chips to be bonded to an upper surface of the substrate are arranged;
- a fixing unit configured to receive the substrate from the supply unit and fix a lower surface of the substrate;
- a laser unit comprising a laser head for bonding the semiconductor chips to the substrate by irradiating a laser beam to the substrate fixed to the fixing unit and a laser transporting portion transporting the laser head;
- a mask comprising a transmitting portion which is configured to transmit through a laser beam irradiated from the laser head of the laser unit and is formed of one of BaF2 and ZnSe;
- a mask holding unit configured to hold the mask above the fixing unit;
- a pressurizing unit configured to lift one of the mask holding unit and the fixing unit relative to the other such that the transmitting portion of the mask pressurizes the plurality of semiconductor chips of the substrate fixed to the fixing unit;
- a discharging unit configured to receive the substrate from the fixing unit and discharge the substrate;
- an infrared camera configured to capture an image of the semiconductor chips to which a laser beam is irradiated by the laser head of the laser unit;
- and
- a controller configured to control operation of the supply unit, the fixing unit, and the discharging unit, and control operation of the laser head of the laser unit by using values measured by the infrared camera.
7 more elements
Dependencies are inferred from the claim text.