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US 12,234,376 B2Granted
Film forming formulation and composition thereof
AssigneeIllinois Tool Works Inc.
InventorDouglas E. Moon
Life of this patent
Estimating the term…
Abstract
A film forming formulation is provided that includes reaction products of phosphoric acid with a strained ring alkoxy silane. The phosphoric acid and the strained ring alkoxy silane are present in a molecular ratio of from 0.9-3.3:1. The film formulation also includes an aqueous solvent. A mold release coating composition is also provided that includes the film forming formulation, a reactive release agent, a base, and an aqueous solvent.
Claims15
A mold release coating composition comprising:
- a formulation comprising reaction products of phosphoric acid with a ring alkoxy silane, where the phosphoric acid and the ring alkoxy silane are present in a molecular ratio of from 0.9-3.3:1;
- a release agent that is a mono epoxide release agent;
- a base;
- and
- an aqueous solvent.
2 more elements
Dependencies are inferred from the claim text.