Electronic device including back surface plate and manufacturing method of back surface plate
AssigneeSamsung Electronics Co., Ltd.
InventorsHosoon Lee, Wonsun Lee, Hyunsuk Choi
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Abstract
According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.
Claims19
A back surface plate configured to form a back surface of an electronic device, the back surface plate comprising:
- a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface;
- and
- a second glass part at least portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area,
- wherein the second glass part has a color different from a color of the first glass part,
- wherein a softening point of the second glass part is lower than a softening point of the first glass part.
A method of manufacturing a back surface plate, the method comprising:
- shaping a first glass part including a first pattern area including a pattern of a predetermined shape on a first surface, the first glass part having a first color;
- seating a second glass part on the first surface of the a first glass part, the second glass part having a second color, the second color being different from the first color;
- placing the first glass part with the second glass part being seated on the first surface of the first glass part, into an area of a lower core structure of a mold structure such that the second surface opposite to the first surface of the first glass part faces the lower core structure of the mold structure;
- preheating the second glass part at a high temperature, and lowering an upper core structure of the mold structure toward the lower core structure;
- causing the second glass part to be penetrated into the first pattern area by pressing the second glass part by the upper core structure;
- and
- hardening the second glass part, which is preheated and then caused to penetrate into the first pattern, by lowering the high temperature.
An electronic device comprising:
- a housing including a front surface plate facing a first direction and a back surface plate facing a second direction opposite to the front surface plate, wherein at least a portion of the front surface plate includes a transparent area;
- a battery disposed inside the housing;
- and
- a display disposed inside the housing and including a screen area exposed through the front surface plate,
- wherein the back surface plate includes:
- a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface;
- and
- a second glass part disposed on the first glass part in the second direction, and including a first shape complimentary to the first pattern area,
- wherein the second glass part has a color different from a color of the first glass part,
- wherein a softening point of the second glass part is lower than a softening point of the first glass part.
Dependencies are inferred from the claim text.