Solid-state additive manufacturing methods for compounding conductive polymer compositions

A method comprising:

• forming a conductive polymer or plastic composition with at least one conductive solid filler and at least one polymer or plastic using solid-state additive manufacturing;
• and
• forming a conductive 3D object by depositing the conductive polymer or plastic composition as a conductive coating or layer in a multi-component part comprising a substrate, wherein the depositing comprises
• feeding the at least one conductive solid filler and the at least one polymer or plastic through a hollow spindle or tool of a solid-state additive manufacturing machine, wherein the hollow spindle or tool comprises a shoulder;
• and
• generating plastic deformation of the at least one conductive solid filler and the at least one polymer or plastic by applying normal, shear and/or frictional forces by way of rotating of the shoulder of the hollow spindle or tool such that the at least one conductive solid filler and/or the at least one polymer or plastic are in a malleable and/or visco-elastic state in an interface region between the substrate and the hollow spindle or tool to deposit the at least one conductive solid filler and the at least one polymer or plastic on the substrate, thereby producing the formed conductive 3D object.