Electronic device including housing
AssigneeSamsung Electronics Co., Ltd.
InventorsKidoc Son, Youngchun Kim, Byounggyu Park, Kyunghwan Song, Hyuckki Lee
Life of this patent
Estimating the term…
Abstract
According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.
Claims12
An electronic device comprising:
- a housing;
- and
- at least one processor disposed inside the housing,
- wherein the housing comprises:
- a metal member comprising a metal including an electro chemical machined first convex and concave pattern formed into a surface of the metal member, and
- an oxide inclusive coating layer exposed to an outside of the housing and disposed on a surface of the first convex and concave pattern of the metal with a shape corresponding to the shape of the first convex and concave pattern, and
- wherein the first convex and concave pattern has at least a portion formed at a substantially uniform pitch and a substantially uniform height.
Dependencies are inferred from the claim text.