Self-assembled guided hole and via patterning over grating

An integrated circuit device (IC) device comprising:

• a layer comprising a first insulator material;
• and
• a plurality of structures formed in the layer, the structures arranged in a hexagonal pattern, the plurality of structures comprising:
• a first set of structures comprising a second insulator material different from the first insulator material;
• and
• a second set of structures comprising a conductive material.

An integrated circuit device (IC) device comprising:

• a layer comprising a first material, the layer comprising an active area and an inactive area, the active area and inactive area comprising different portions of a cross-section through the layer;
• and
• a plurality of structures formed in the active area of the layer and the inactive area of the layer, the structures comprising a second material different from the first material;
• wherein, in the cross-section through the layer, in at least a portion of the active area, the plurality of structures are arranged in a hexagonal pattern.