Resin molded product production method, molding die, and resin molding apparatus

A method for producing a resin molded product obtained by subjecting an object to be molded being a chip temporarily bonded to a carrier via a temporary bonding sheet to transfer molding, comprising the steps of:

• resin-molding the object to be molded by transfer molding using a molding die, and
• peeling the temporary bonding sheet from the resin molded product after the resin-molding, wherein
• the resin-molding is performed in a state where a gap is formed so that the temporary bonding sheet disposed in the molding die and a surface facing the temporary bonding sheet on a side where the chip is temporarily bonded do not come into contact with each other,
• the temporary bonding sheet is a temporary bonding sheet that is peelable from the resin molded product by heating, and
• the peeling is performed by heating the temporary bonding sheet and the resin molded product to a temperature higher than that in the resin-molding.