US 12,228,967 B2Granted

Electronic device including photosensor module

AssigneeSamsung Electronics Co., Ltd.

InventorsSeonho Han, Donghoo Jang, Jongah Kim, Shinhun Moon, Hyungsoo Park

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Abstract

An electronic device according to various embodiments of the present disclosure may comprise: a housing including a front plate facing forward and a rear plate facing rearward; a display assembly comprising a display visible through at least a portion of the front plate and which includes an upper portion, a lower portion overlapping at least a partial region of the upper assembly and that includes a first opening, and a flexible circuit board overlapping at least a partial region of the lower portion and that includes a second opening corresponding to at least a portion of the first opening; a photosensor module including a sensing unit comprising a sensor corresponding to at least a portion of the second opening, and a plurality of pads arranged to be adjacent to the sensing unit and electrically coupled to the flexible circuit board; and an electrical component and/or mechanical structure arranged between the photosensor module and the rear plate and spaced from the photosensor module at a first distance.

Claims20

Dependent claims

An electronic device comprising:

a housing including a front plate facing a front surface and a rear plate facing a rear surface;
a display assembly comprising a display visible through at least a part of the front plate;
wherein the display assembly includes:
an upper portion;
a lower portion overlapping at least a partial area of the upper portion and including a first opening;
and
a flexible circuit board overlapping at least a partial area of the lower portion and including a first surface facing the lower portion, a second surface opposite to the first surface, and a second opening corresponding to at least a part of the first opening,
wherein the lower portion is disposed between the upper portion and the flexible circuit board;
and
a photosensor module including a sensing unit comprising a sensor corresponding to at least a part of the second opening and a plurality of pads disposed adjacent to the sensing unit and electrically coupled to the flexible circuit board, wherein the plurality of pads are disposed between the sensing unit and the second surface of the flexible circuit board to space the sensing unit apart from the second surface of the flexible circuit board,
wherein the photosensor module is disposed completely under the second surface of the flexible circuit board and configured to detect at least a part of light sequentially passing through the upper portion, the first opening of the lower portion and the second opening of the flexible circuit board from an outside of the electronic device,
wherein the flexible circuit board includes a base, first bent part extending from the base in a first direction and towards the front surface and disposed on the second surface around the photosensor module, and a second bent part extending from the base in a second direction that is perpendicular to the first direction and towards the front surface, and at least one of the first bent part and the second bent part connected to the upper portion, and
wherein the first bent part is coupled to a groove included on the second surface and adjacent to an edge of the flexible circuit board, the first bent part is curved around the edge of the flexible circuit board towards the front surface, and the first bent part is bent in a U-shape that at least partially surrounds the photosensor module when viewed from below the rear plate.

10 more elements

An electronic device comprising:

a front plate forming at least a part of a front surface of the electronic device;
a rear plate forming a least a part of a rear surface of the electronic device;
a display assembly including a display disposed adjacent to the front plate and visible through at least a part of the front plate,
wherein the display assembly includes:
a plurality of layers with a first opening passing through at least some of the layers formed therein, and
a flexible circuit board disposed under the plurality of layers and including a first surface facing the plurality of layers, a second surface opposite to the first surface, and a second opening smaller than the first opening and corresponding to at least a part of the first opening;
and
a photosensor module positioned completely under the second surface of the flexible circuit board and coupled to the second surface of the flexible circuit board through a plurality of pads, wherein the plurality of pads are disposed on the second surface of the flexible circuit board to space the photosensor module apart from the second surface of the flexible circuit board,
wherein the flexible circuit board includes a base, a first bent part extending from the base in a first direction and towards the front surface and disposed on the second surface around the photosensor module, and a second bent part extending from the base in a second direction that is perpendicular to the first direction and towards the front surface, and at least one of the first bent part and the second bent part connected to the upper portion, and
wherein the first bent part is coupled to a groove included on the second surface and adjacent to an edge of the flexible circuit board, the first bent part is curved around the edge of the flexible circuit board towards the front surface, and the first bent part is bent in a U-shape that at least partially surrounds the photosensor module when viewed from below the rear plate.

7 more elements

Dependencies are inferred from the claim text.