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US 12,227,938 B2Granted
Molded body, sound absorbing material, vibration absorbing material
AssigneeTosoh Corporation
InventorSatoru Nakajima
Life of this patent
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Abstract
Disclosed a molded body including: a plurality of cavity portions formed inside a molding material; and a plurality of neck portions provided in each of the plurality of cavity portions and configured to communicate with the cavity portions, wherein some of the plurality of neck portions communicate with a surface and/or the cavity portion exposed on the surface, wherein at least some of the plurality of neck portions cause the plurality of cavity portions to communicate with each other, and wherein an inner surface of the neck portion is formed by the molding material itself.
Claims12
A molded body comprising:
- a plurality of cavity portions formed inside a molding material;
- and
- a plurality of neck portions provided in each of the plurality of cavity portions and configured to communicate with the cavity portions,
- wherein some of the plurality of neck portions communicate with a surface and/or the cavity portion exposed on the surface,
- wherein at least some of the plurality of neck portions cause the plurality of cavity portions to communicate with each other,
- wherein an inner surface of the neck portion is formed by the molding material itself, and
- wherein a protruding portion is formed by the neck portion, the protruding portion protruding from an inner surface of the cavity portion into the cavity portion, and a protruding height of the protruding portion with respect to the inner surface of the cavity portion is 100 μm or less.
4 more elements
Dependencies are inferred from the claim text.