Substrate processing apparatus, method for processing substrate, and method for manufacturing semiconductor device

A substrate processing apparatus for forming an annular film on an outer edge portion of a substrate, the substrate processing apparatus comprising:

• a rotation support table capable of supporting and rotating the substrate;
• a chemical liquid nozzle that is arranged above the outer edge portion of the substrate that is supported by the rotation support table, and through which a chemical liquid is applied to the outer edge portion;
• and
• a solidified film forming unit that is arranged at least either on an upper side or on a lower side of the outer edge portion of the substrate that is supported by the rotation support table, and on a downstream side, of a position, in a direction of rotation of the substrate, where the chemical liquid nozzle is arranged, the solid film-forming unit solidifying the chemical liquid applied to the outer edge portion, to form a solidified film that forms a part of the annular film,
• wherein
• the chemical liquid nozzle has a plurality of ejection orifices individually arranged in a circular region so as to form a lattice pattern or a concentric pattern, through which the chemical liquid is ejected simultaneously.