Thermosetting resin composition, thermosetting resin film, thermoset film, multilayer body, printed wiring board and method for producing same
AssigneeKaneka Corporation
InventorsFumiya Kono, Masayoshi Kido
Life of this patent
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Abstract
A thermosetting resin composition comprises a component (A) that is a compound having an imide group and a carboxy group in one molecule, and a component (B) that is a polymer having a repeating unit represented by the following general formula (1). R1 and R2 in formula (1) are each independently a hydrogen atom or a methyl group. R3 in formula (1) is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure. R4 in formula (1) is a hydrogen atom or an alkyl group. m and n in formula (1) are each independently an integer of 1 or more, and m/n may be 1 to 50.
Claims18
A thermosetting resin composition comprising:
- a component (A) that is a compound having an imide group and a carboxy group in one molecule;
- and
- a component (B) that is a polymer having a repeating unit represented by the following general formula (1):
- wherein in the general formula (1), R1 and R2 are each independently a hydrogen atom or a methyl group;
- R3 is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure;
- R4 is a hydrogen atom or an alkyl group;
- and m and n are each independently an integer of 1 or more, and m/n is 1 to 50,
- wherein an amount of the component (B) in the thermosetting resin composition is 100 to 3000 parts by mass based on 100 parts by mass of a solid content of the component (A), and
- wherein a molar ratio of a total amount of carboxy groups in the thermosetting resin composition to an amount of oxazoline groups in the component (B) is 0.1 to 3.0.
Dependencies are inferred from the claim text.