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US 12,226,937 B2Granted
Mold release film, film laminate, method for producing mold release film, and method for producing film laminate
AssigneeMitsubishi Chemical Corporation
InventorYosuke Oseki
Life of this patent
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Abstract
A mold release film, including a mold release layer formed by curing a mold release layer composition containing a curable silicone having a fluorine substituent, a curable silicone having no fluorine substituent, and a curing catalyst, on at least one surface of a substrate film. In a concentration distribution of fluorine atoms in a thickness direction within the mold release layer, fluorine atoms are unevenly distributed on a surface of the mold release layer, and a fluorine atom concentration on one side of the mold release layer is 39.0 atom concentration % or more.
Claims26
A mold release film, comprising:
- a mold release layer formed by curing a mold release layer composition comprising a curable silicone comprising a fluorine substituent, a curable silicone having no fluorine substituent, and a curing catalyst, on at least one surface of a substrate film,
- wherein a thickness of the mold release layer after drying is in a range of from 0.05 to 0.25 μm,
- wherein a mass ratio of the curable silicone having a fluorine substituent to the curable silicone having no fluorine substituent is in a range of from 1:50 to 10:1, and
- wherein, in a concentration distribution of fluorine atoms in a thickness direction within the mold release layer, fluorine atoms are unevenly distributed on a surface of the mold release layer, and a fluorine atom concentration on one side of the mold release layer is 39.0 atom concentration % or more.
1 more element
A mold release film, comprising:
- a mold release layer formed by curing a mold release layer composition comprising a curable silicone comprising a fluorine substituent, a curable silicone having no fluorine substituent, and a curing catalyst, on at least one surface of a substrate film,
- wherein a thickness of the mold release layer after drying is in a range of from 0.05 to 0.25 μm,
- wherein a mass ratio of the curable silicone having a fluorine substituent to the curable silicone having no fluorine substituent is in a range of from 1:50 to 10:1, and
- wherein the mold release film has each fluorine atom concentration in atom % at second to tenth measurement points being 80.0% or less of a fluorine atom concentration in atom % at a first measurement point at a sputtering time 0, when a concentration distribution of fluorine atoms in a thickness direction within the mold release layer is measured under a constant sputtering speed by using X-ray photoelectron spectroscopy with gas cluster ion beam, and the concentration distribution of fluorine atoms plotted as vertical axis:
- fluorine atom concentration in atom %, and horizontal axis:
- sputtering time in minutes is evenly divided into 9 sections by a total sputtering time to determine the first measurement point at the sputtering time 0 and the second to tenth measurement points.
3 more elements
A mold release film, comprising:
- a mold release layer formed by curing a mold release layer composition comprising a curable silicone comprising a fluorine substituent, a curable silicone having no fluorine substituent, and a curing catalyst, on at least one surface of a substrate film,
- wherein a thickness of the mold release layer after drying is in a range of from 0.05 to 0.25 μm,
- wherein a mass ratio of the curable silicone having a fluorine substituent to the curable silicone having no fluorine substituent is in a range of from 1:50 to 10:1, and
- wherein the mold release film has an average fluorine atom concentration in atom % of sixth to tenth measurement points being higher than 2.2% of a fluorine atom concentration in atom % at a first measurement point at a sputtering time 0, when a concentration distribution of fluorine atoms in a thickness direction within the mold release layer is measured under a constant sputtering speed by using X-ray photoelectron spectroscopy with gas cluster ion beam, and the concentration distribution of fluorine atoms plotted as vertical axis:
- fluorine atom concentration in atom %, and horizontal axis:
- sputtering time in minutes is evenly divided into 9 sections by a total sputtering time to determine the first measurement point at the sputtering time 0 and the second to tenth measurement points.
3 more elements
Dependencies are inferred from the claim text.