# US 12,225,804 B2 · Electroluminescence display device having a through-hole in display area

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- Number: US 12,225,804 B2
- Document ID: US12225804B2
- Status: Granted
- Kind: B2
- Application number: 18/382,956
- Filed: 2023-10-23
- Published: 2024-02-15
- Granted: 2025-02-11
- Earliest claimed: 2018-12-31
- Assignees: LG Display Co., Ltd.
- Applicants: LG Display Co., Ltd.
- Inventors: HaeRi Huh
- Web page: https://patentgrep.com/patent/US12225804B2

## CPC

- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10H 20/821: of the light-emitting regions, e.g. non-planar junctions
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10K 59/121: characterised by the geometry or disposition of pixel elements
- H10K 59/122: Pixel-defining structures or layers, e.g. banks
- H10K 59/124: Insulating layers formed between TFT elements and OLED elements
- H10K 59/8731: {multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers}
- H10K 59/88: Dummy elements, i.e. elements having non-functional features
- H10W 90/00: Package configurations
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Discussed is an electroluminescence display device including a substrate having a display area and a non-display area, a light emitting diode in the display area, an encapsulation layer on the light emitting diode, the encapsulation layer including a first inorganic encapsulation layer, and a second inorganic encapsulation layer, an upper passivation film on the second inorganic encapsulation layer, a through-hole inside the display area to penetrate the substrate, an inner dam surrounding the through-hole, a trench between the inner dam and the through-hole, a buffer layer, and a thin film transistor electrically connected to the light emitting diode. The buffer layer is on the display area except at the through-hole and passes below the dam and the trench. The first and second inorganic encapsulation layers cover the inner dam and the trench. The trench includes a recessed portion, and the light emitting diode includes a light emitting layer.

## Claims

### Claim 1

An electroluminescence display device comprising:
a substrate having a display area and a non-display area arranged near the display area;
a light emitting diode disposed in the display area;
an encapsulation layer disposed on the light emitting diode, the encapsulation layer including a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer disposed between the first and second inorganic encapsulation layers;
an upper passivation film disposed on the second inorganic encapsulation layer;
a through-hole arranged inside the display area to penetrate the substrate;
an inner dam surrounding the through-hole;
a trench disposed between the inner dam and the through-hole; and
a buffer layer on which a thin film transistor is arranged, the thin film transistor electrically connected to the light emitting diode,
wherein the buffer layer is disposed on the display area except at the through-hole and passes below the inner dam and the trench,
wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the inner dam and the trench in the display area,
wherein the trench includes a recessed portion recessed to reach an upper surface of the buffer layer between the through-hole and the inner dam, and
wherein the light emitting diode includes a light emitting layer that is disconnected at the trench.

### Claim 2 (depends on 1)

The electroluminescence display device of claim 1, wherein an etch-stopper is arranged between the trench and the through-hole.

### Claim 3 (depends on 2)

The electroluminescence display device of claim 2, wherein the display area includes pixels each having the light emitting diode for expressing image information and the thin film transistor for driving the light emitting diode, the pixels being arranged in a matrix arrangement, and
wherein the through-hole is an area where the substrate, the light emitting diode and the thin film transistor are not provided.

### Claim 4 (depends on 3)

The electroluminescence display device of claim 3, wherein the trench includes:
a bottom surface defined by an upper surface of the buffer layer exposed by the recessed portion of the trench;
an upper opening defined by an uppermost surface of a layer including the recessed portion of the trench; and
a sidewall connecting the bottom surface of the trench with the upper opening of the trench, and
wherein a dummy light emitting layer is disposed on the bottom surface of the trench.

### Claim 5 (depends on 4)

The electroluminescence display device of claim 4, wherein a dummy common electrode is disposed on the dummy light emitting layer on the bottom surface of the trench.

### Claim 6 (depends on 2)

The electroluminescence display device of claim 2, wherein the upper passivation film covers a side surface of the etch-stopper adjacent to the through-hole and a part of an upper surface of the etch-stopper.

### Claim 7 (depends on 2)

The electroluminescence display device of claim 2, wherein the etch-stopper includes at least one organic material.

### Claim 8 (depends on 1)

The electroluminescence display device of claim 1, wherein the upper passivation film reaches to an end of the through-hole.

### Claim 9 (depends on 1)

The electroluminescence display device of claim 1, further comprising a touch electrode disposed on the upper passivation film.

### Claim 10 (depends on 1)

The electroluminescence display device of claim 1, wherein the light emitting layer covers a pixel driving electrode of the light emitting diode and the inner dam, and
wherein the light emitting layer extends continuously from the pixel driving electrode to an opening of the trench.

### Claim 11 (depends on 1)

The electroluminescence display device of claim 1, wherein the upper passivation film and the buffer film contact each other at a location adjacent to the through-hole.

### Claim 12 (depends on 11)

The electroluminescence display device of claim 11, wherein a portion of the upper passivation film that contact the buffer film also contacts the substrate.

### Claim 13 (depends on 1)

The electroluminescence display device of claim 1, wherein an end of the upper passivation film matches an end of the through-hole.

### Claim 14 (depends on 1)

The electroluminescence display device of claim 1, wherein a lateral surface of the substrate is exposed by an end of the through-hole.

### Claim 15 (depends on 1)

The electroluminescence display device of claim 1, wherein at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer is located in the trench.

### Claim 16

An electroluminescence display device comprising:
a substrate having a display area and a non-display area arranged near the display area;
a light emitting diode disposed in the display area;
an encapsulation layer disposed on the light emitting diode;
an upper passivation film disposed on the encapsulation layer;
a through-hole arranged inside the display area to penetrate the substrate;
an inner dam surrounding the through-hole;
a trench disposed between the inner dam and the through-hole; and
a buffer layer disposed in the display area,
wherein a portion of the buffer layer between the through-hole and the inner dam is exposed by the trench.

### Claim 17 (depends on 16)

The electroluminescence display device of claim 16, wherein a portion of the encapsulation layer is disposed in the trench.

### Claim 18 (depends on 16)

The electroluminescence display device of claim 16, wherein an end of the upper passivation film and the buffer layer contact each other at a location adjacent to an end of the through-hole.
