# US 12,225,733 B2 · System-on-chip with ferroelectric random access memory and tunable capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,225,733 B2 - Document ID: US12225733B2 - Status: Granted - Kind: B2 - Application number: 17/814,610 - Filed: 2022-07-25 - Published: 2022-11-10 - Granted: 2025-02-11 - Earliest claimed: 2019-12-30 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Sai-Hooi Yeong; Chi On Chui; Chenchen Jacob Wang - Web page: https://patentgrep.com/patent/US12225733B2 ## CPC - H10B 53/40: characterised by the peripheral circuit region - H10D 1/682: {having dielectrics comprising perovskite structures} - H10B 53/30: characterised by the memory core region - H10D 1/692: {Electrodes} - H10D 1/694: {comprising noble metals or noble metal oxides} - H10D 1/716: {having vertical extensions} - H10B: ELECTRONIC MEMORY DEVICES - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A semiconductor device includes: a substrate; a first dielectric layer over the substrate; a memory cell over the substrate in a first region of the semiconductor device, where the memory cell includes a first ferroelectric structure in the first dielectric layer, where the first ferroelectric structure includes a first bottom electrode, a first top electrode, and a first ferroelectric layer in between; and a tunable capacitor over the substrate in a second region of the semiconductor device, where the tunable capacitor includes a second ferroelectric structure, where the second ferroelectric structure includes a second bottom electrode, a second top electrode, and a second ferroelectric layer in between, where at least a portion of the second ferroelectric structure is in the first dielectric layer. ## Claims ### Claim 1 A method of forming a semiconductor device, the method comprising: forming a first dielectric layer over a substrate, the first dielectric layer extending from a first device region of the semiconductor device to a second device region of the semiconductor device; forming a memory cell of a memory device over the substrate in the first device region, wherein forming the memory cell comprises forming a first ferroelectric structure in the first dielectric layer, wherein forming the first ferroelectric structure comprises forming a first bottom electrode, a first ferroelectric layer, and a first top electrode successively over the substrate, wherein the first bottom electrode and the first top electrode are formed to have a same width such that sidewalls of the first bottom electrode are aligned with respective sidewalls of the first top electrode; and forming a tunable capacitor of a radio frequency (RF) circuit over the substrate in the second device region, wherein forming the tunable capacitor comprises forming a second ferroelectric structure in the first dielectric layer, wherein forming the second ferroelectric structure comprises forming a second bottom electrode, a second ferroelectric layer, and a second top electrode successively over the substrate, wherein the second bottom electrode is formed to be wider than the second top electrode such that the second bottom electrode extends beyond lateral extents of the second top electrode. ### Claim 2 (depends on 1) The method of claim 1, wherein the first bottom electrode and the second bottom electrode are formed of a same conductive material in a first processing step, wherein the first ferroelectric layer and the second ferroelectric layer are formed of a same ferroelectric material in a second processing step, and wherein the first top electrode and the second top electrode are formed of a same conductive material in a third processing step. ### Claim 3 (depends on 1) The method of claim 1, wherein the method further comprises: forming a first conductive feature over and contacting an upper surface of the second top electrode distal from the substrate; forming a second conductive feature over and contacting an upper surface of the second bottom electrode distal from the substrate; and forming a third conductive feature under and contacting a lower surface of the second bottom electrode facing the substrate. ### Claim 4 (depends on 1) The method of claim 1, further comprising forming a fixed capacitor over the substrate in the second device region, wherein forming the fixed capacitor comprises forming a third ferroelectric structure in the first dielectric layer, wherein forming the third ferroelectric structure comprises forming a third bottom electrode, a third ferroelectric layer, and a third top electrode successively over the substrate, wherein the fixed capacitor is formed to be connected in parallel with the tunable capacitor. ### Claim 5 (depends on 4) The method of claim 4, wherein the third top electrode and the third bottom electrode are formed to have a same width. ### Claim 6 (depends on 1) The method of claim 1, wherein the first top electrode is formed to have a coplanar upper surface with the first dielectric layer, and the first bottom electrode is formed to have a coplanar lower surface with the first dielectric layer. ### Claim 7 (depends on 6) The method of claim 6, wherein the second top electrode is formed to have a coplanar upper surface with the first dielectric layer, and the second bottom electrode is formed to have a coplanar lower surface with the first dielectric layer. ### Claim 8 (depends on 6) The method of claim 6, wherein the second bottom electrode is formed to have a first portion extending along an upper surface of the first dielectric layer distal from the substrate, a second portion extending from the upper surface of the first dielectric layer to a lower surface of the first dielectric layer facing the substrate, and a third portion at the lower surface of the first dielectric layer and extending in parallel with the lower surface of the first dielectric layer. ### Claim 9 (depends on 8) The method of claim 8, wherein the second ferroelectric layer is formed to extend conformally along an upper surface of the second bottom electrode, wherein the second top electrode is formed to have a first portion extending into the first dielectric layer and surrounded by the second ferroelectric layer, and have a second portion over the first portion and covering an upper surface of the second ferroelectric layer. ### Claim 10 A method of forming a semiconductor device, the method comprising: forming a first dielectric layer over a substrate, the first dielectric layer extending from a first device region of the semiconductor device to a second device region of the semiconductor device; forming a memory cell of a memory device over the substrate in the first device region, wherein forming the memory cell comprises forming a first ferroelectric structure in the first dielectric layer, wherein forming the first ferroelectric structure comprises forming a first bottom electrode, a first ferroelectric layer, and a first top electrode successively over the substrate; forming a tunable capacitor of a radio frequency (RF) circuit over the substrate in the second device region, wherein forming the tunable capacitor comprises forming a second ferroelectric structure in the first dielectric layer, wherein forming the second ferroelectric structure comprises forming a second bottom electrode, a second ferroelectric layer, and a second top electrode successively over the substrate; forming a fixed capacitor over the substrate in the second device region, wherein forming the fixed capacitor comprises forming a third ferroelectric structure in the first dielectric layer, wherein forming the third ferroelectric structure comprises forming a third bottom electrode, a third ferroelectric layer, and a third top electrode successively over the substrate; and connecting the fixed capacitor and the tunable capacitor in parallel. ### Claim 11 (depends on 10) The method of claim 10, wherein a width of the second bottom electrode is larger than that of the second top electrode. ### Claim 12 (depends on 11) The method of claim 11, wherein a width of the first bottom electrode is the same as that of the first top electrode. ### Claim 13 (depends on 12) The method of claim 12, wherein a width of the third bottom electrode is the same as that of the third top electrode. ### Claim 14 (depends on 10) The method of claim 10, wherein connecting the fixed capacitor and the tunable capacitor in parallel comprises: forming, in a second dielectric layer disposed between the first dielectric layer and the substrate, a first via and a second via that are connected to a lower surface of the second bottom electrode and a lower surface of the third bottom electrode, respectively, wherein the first via and the second via are formed to be connected to a same conductive feature embedded in the second dielectric layer; and forming, in a third dielectric layer over the first dielectric layer, a third via and a fourth via that are connected to an upper surface of the second top electrode and an upper surface of the third top electrode, respectively, wherein the third via and the fourth via are electrically coupled together. ### Claim 15 (depends on 14) The method of claim 14, further comprising: forming, in the third dielectric layer, a fifth via connected to an upper surface of the second bottom electrode. ### Claim 16 (depends on 15) The method of claim 15, wherein the fifth via is configured to be connected to a modulation voltage supply, wherein a capacitance of the tunable capacitor is configured to be varied by changing a voltage of the modulation voltage supply. ### Claim 17 A method of forming a semiconductor device, the method comprising: forming a first dielectric layer over a substrate, the first dielectric layer extending from a first device region of the semiconductor device to a second device region of the semiconductor device; forming a memory cell of a memory device over the substrate in the first device region, wherein forming the memory cell comprises forming a first ferroelectric structure in the first dielectric layer, wherein forming the first ferroelectric structure comprises forming a first bottom electrode, a first ferroelectric layer, and a first top electrode successively over the substrate; and forming a tunable capacitor of a radio frequency (RF) circuit over the substrate in the second device region, wherein forming the tunable capacitor comprises forming a second ferroelectric structure in the first dielectric layer, wherein forming the second ferroelectric structure comprises forming a second bottom electrode, a second ferroelectric layer, and a second top electrode successively over the substrate, wherein the second bottom electrode is formed to be wider than the second top electrode such that a first sidewall of the second bottom electrode is aligned along a same line with a first sidewall of the second top electrode, and a second opposing sidewall of the second bottom electrode extends beyond lateral extents of the second top electrode. ### Claim 18 (depends on 17) The method of claim 17, wherein the first bottom electrode is formed to have a same width with the first top electrode such that sidewalls of the first bottom electrode are aligned along the same lines with respective sidewalls of the first top electrode. ### Claim 19 (depends on 17) The method of claim 17, further comprising: forming a fixed capacitor over the substrate in the second device region, wherein forming the fixed capacitor comprises forming a third ferroelectric structure in the first dielectric layer, wherein forming the third ferroelectric structure comprises forming a third bottom electrode, a third ferroelectric layer, and a third top electrode successively over the substrate, wherein the fixed capacitor is formed to be connected in parallel with the tunable capacitor. ### Claim 20 (depends on 17) The method of claim 17, further comprising: forming a second dielectric layer over the first dielectric layer; and forming a first via and a second via in the second dielectric layer and over the tunable capacitor, wherein the first via extends through the second dielectric layer and contacts an upper surface of the second top electrode distal from the substrate, wherein the second via extends through the second dielectric layer, into the first dielectric layer, and contacts an upper surface of the second bottom electrode distal from the substrate.