# US 12,225,689 B2 · Cooling system for the liquid immersion cooling of electronic components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,225,689 B2 - Document ID: US12225689B2 - Status: Granted - Kind: B2 - Application number: 17/996,446 - Filed: 2021-03-30 - Published: 2023-06-29 - Granted: 2025-02-11 - Earliest claimed: 2020-04-25 - Assignees: Wieland-Werke AG - Applicants: Wieland-Werke AG - Inventors: Achim Gotterbarm; Manfred Knab; Jochen Dietl; Harald Gaibler - Web page: https://patentgrep.com/patent/US12225689B2 ## CPC - H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds} - H05K 7/203: {by immersion} - G06F 1/20: Cooling means - H05K 5/06: Hermetically-sealed casings {(specially adapted for small components H05K5/0095)} - H05K 7/20236: {by immersion} - H05K 7/20263: {Heat dissipaters releasing heat from coolant} - H05K 7/20809: {within server blades for removing heat from heat source} - G06F 2200/201: Cooling arrangements using cooling fluid - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A cooling system for the liquid immersion cooling of electronic components. The system includes a container containing, in an interior, liquid heat transfer fluid into which electronic components are immersed, the container having a gas space above the surface of the liquid heat transfer fluid, and a heat exchanger device in the gas space of the container for forming liquid heat transfer fluid. The cooling system further includes a lock device on the container for exchanging electronic components, and the lock device has a lock space, which lock space is hermetically sealed with respect to the gas space of the container to prevent gas exchange. ## Claims ### Claim 1 A cooling system for liquid immersion cooling of electronic components, comprising: a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid; a heat exchanger device in the gas space of the container for forming the liquid heat transfer fluid; a lock device on the container for exchanging the electronic components, the lock device having a lock space, the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange; and a partition arranged to hermetically seal the lock space, the partition being immersed to an immersion depth in the liquid heat transfer fluid. ### Claim 2 (depends on 1) The cooling system as claimed in claim 1, wherein the immersion depth of the partition is variable. ### Claim 3 (depends on 1) The cooling system as claimed in claim 1, further including a loading system arranged in the container, the loading system transporting the electronic components from the lock device to an operating position for exchange of the electronic components. ### Claim 4 (depends on 1) The cooling system as claimed in claim 1, further including a storage device disposed in the lock space for the intermediate storage of the electronic components. ### Claim 5 (depends on 1) The cooling system as claimed in claim 1, wherein the heat exchanger device is a first heat exchanger device, and the cooling system includes a second heat exchanger device configured as a lock cooling system, the locking cooling system being configured to specifically control a temperature of the liquid heat transfer fluid located in the lock space. ### Claim 6 A cooling system for liquid immersion cooling of electronic components comprising: a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid; a heat exchanger device in the gas space of the container for forming the liquid heat transfer fluid; and a lock device on the container for exchanging the electronic components, the lock device having a lock space, the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange; wherein the lock device and/or the container includes a degassing device, the degassing device separating non-condensable gases from gaseous heat transfer fluid. ### Claim 7 A cooling system for liquid immersion cooling of electronic components comprising: a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid; a heat exchanger in the gas space of the container for forming the liquid heat transfer fluid; a lock device on the container for exchanging the electronic components, the lock device having a lock space, the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange; and a gas connection, the lock device being flooded with a protective gas via the gas connection. ### Claim 8 (depends on 1) The cooling system as claimed in claim 1, further including a pressure equalization tank arranged on the container and/or on the lock device. ### Claim 9 (depends on 1) The cooling system as claimed in claim 1, wherein the container includes an auxiliary heating system, the auxiliary heating system serving as an aid for evaporation of the liquid heat transfer fluid. ### Claim 10 (depends on 1) The cooling system as claimed in claim 1, wherein the container is configured as a pressure vessel operating at a negative pressure and/or a positive pressure.