# US 12,225,669 B2 · Manufacturing method of continuous sheet for circuit board production and continuous sheet for circuit board production manufactured therefrom > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,225,669 B2 - Document ID: US12225669B2 - Status: Granted - Kind: B2 - Application number: 16/966,766 - Filed: 2019-10-01 - Published: 2021-02-04 - Granted: 2025-02-11 - Earliest claimed: 2018-10-04 - Assignees: LG Chem, Ltd. - Applicants: LG Chem, Ltd. - Inventors: Hyung Suk Oh; Kwanghee Jung; Chul Young Kim; Ji Hyup Kim - Web page: https://patentgrep.com/patent/US12225669B2 ## CPC - H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} - B32B 15/01: all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} - B32B 38/18: Handling of layers or the laminate - H05K 1/03: Use of materials for the substrate - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 3/0064: {onto a polymeric substrate} - H05K 3/02: in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding - H05K 2203/1545: Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ## Abstract The present disclosure relates to a manufacturing method of a continuous sheet for circuit board production providing reel type laminates in a roll-to-roll continuous process without a belt press by connecting at least two or more sheet type metal laminates using an adhesion substrate which includes a reinforcement film and a conductor, the manufacturing method providing improved mechanical properties, and excellent chemical resistance and productivity, and the continuous sheet for circuit board production manufactured therefrom. ## Claims ### Claim 1 A manufacturing method of a continuous sheet for circuit board production comprising: providing at least two or more sheet type metal laminates, each of which including a metal foil, adjoined in series in a length direction of the metal foil, and winding an adhesion substrate one or more turns around a perimeter of an adjoining portion of the adjoined sheet type metal laminates, wherein the adhesion substrate includes a first adhesion substrate and a second adhesion substrate, wherein the step of winding an adhesion substrate includes: winding the first adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adjoining portion of the adjoined sheet type metal laminates; and winding the second adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adjoining portion of the adjoined sheet type metal laminates, around which the first adhesion substrate has been wound, subsequently to the first adhesion substrate. ### Claim 2 (depends on 1) The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the first and second adhesion substrates are: 1) A reinforcement adhesion substrate including a reinforcement film layer, and an adhesive layer coated onto at least one surface of the reinforcement film layer; and 2) a conductor adhesion substrate including a conductor layer, and an adhesive layer coated onto at least one surface of the conductor layer, or vice versa. ### Claim 3 (depends on 2) The manufacturing method of a continuous sheet for circuit board production according to claim 2, wherein the conductor layer has a thickness of 7 μm to 35 μm and includes copper, steel use stainless, or aluminum foil. ### Claim 4 (depends on 2) The manufacturing method of a continuous sheet for circuit board production according to claim 2, wherein the reinforcement film layer has a thickness of 5 μm to 25 μm and includes one or more polymer resins selected from the group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate glycol, polycarbonate and polyphenylene sulfide. ### Claim 5 (depends on 2) The manufacturing method of a continuous sheet for circuit board production according to claim 2, wherein the adhesive layer has a thickness of 1 μm to 10 μm and is formed using a varnish containing an adhesive resin and a conductive powder in a weight ratio of 1:0.005 to 1:0.015. ### Claim 6 (depends on 5) The manufacturing method of a continuous sheet for circuit board production according to claim 5, wherein the conductive powder includes one or more selected from the group consisting of copper, aluminum, nickel, silver, and iron. ### Claim 7 (depends on 5) The manufacturing method of a continuous sheet for circuit board production according to claim 5, wherein the adhesive resin includes one or more selected from the group consisting of polyimide-based resin, epoxy-based resin, acrylic-based resin, phenoxy-based resin and polyisocyanate-based resin, having a weight average molecular weight of 33000 g/mol to 38000 g/mol. ### Claim 8 (depends on 1) The manufacturing method of a continuous sheet for circuit board production according to claim 1, further comprising a step of forming a metal layer on the outermost part of the adhesion substrate. ### Claim 9 (depends on 1) The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the sheet type metal laminate is manufactured by a method comprising: producing a prepreg by impregnating a fabric substrate into a thermosetting resin vanish and then semi-curing the thermosetting resin vanish, laminating one or more of the prepregs, and laminating a metal foil on one or both sides of the prepreg, followed by heating and pressing. ### Claim 10 (depends on 1) The manufacturing method of a continuous sheet for circuit board production according to claim 1, further comprising a step of winding at least two or more sheet type metal laminates connected by the adhesion substrate in a horizontal direction via a guide means. ### Claim 11 (depends on 1) The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the step of providing at least two or more sheet type metal laminates comprises: providing the at least two or more sheet type metal laminates cut into a predetermined size; and placing the at least two or more sheet type metal laminates horizontally and so as to be in contact with each other.