# US 12,225,663 B2 · Antenna structure and display device including the same

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- Number: US 12,225,663 B2
- Document ID: US12225663B2
- Status: Granted
- Kind: B2
- Application number: 18/131,984
- Filed: 2023-04-07
- Published: 2023-10-12
- Granted: 2025-02-11
- Earliest claimed: 2022-04-08
- Assignees: Dongwoo Fine-Chem Co., Ltd.
- Applicants: Dongwoo Fine-Chem Co., Ltd.
- Inventors: Na Yeon Kim; Dae Kyu Kim; Han Sub Ryu
- Web page: https://patentgrep.com/patent/US12225663B2

## CPC

- H05K 1/119: {Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence)}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H01Q 1/1271: {for mounting on windscreens}
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)}
- H01Q 21/08: the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)}
- H01Q 21/24: Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction {(circularly polarised patch antennas H01Q9/0428; circularly polarised horns H01Q13/0241; cross-polarised horns H01Q13/0258; polarisation converters H01Q15/242; cross-polarised rear feeds H01Q19/136; crossed polarisation dual antenna H01Q25/001)}
- H05K 3/32: electrically connecting electric components or wires to printed circuits
- H01Q 1/243: {with built-in antennas}
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

An antenna structure according to an embodiment includes an antenna device, a circuit board connected to the antenna device and including an inner insulation layer, and an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board. A portion of the inner insulation layer covered by the outer insulation layer may have a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.

## Claims

### Claim 1

An antenna structure comprising:
an antenna device comprising an antenna unit;
a circuit board electrically connected to the antenna unit, the circuit board comprising an inner insulation layer; and
an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board,
wherein a portion of the inner insulation layer covered by the outer insulation layer has a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.

### Claim 2 (depends on 1)

The antenna structure according to claim 1, wherein the inner insulation layer comprises an antenna bonding area overlapped with the antenna device in a planar direction and a circuit extension area which is not overlapped with the antenna device in the planar direction; and
the outer insulation layer covers the antenna bonding area.

### Claim 3 (depends on 2)

The antenna structure according to claim 2, wherein the antenna bonding area has a smaller thickness than a thickness of the circuit extension area.

### Claim 4 (depends on 2)

The antenna structure according to claim 2, wherein the inner insulation layer comprises a core layer and a bonding sheet disposed on the core layer, and
the core layer is included in the antenna bonding area and the circuit extension area, and the bonding sheet is included in the circuit extension area and is excluded from the antenna bonding area.

### Claim 5 (depends on 4)

The antenna structure according to claim 4, wherein the circuit board further comprises a circuit wiring disposed on a lower surface of the core layer and electrically connected to the antenna unit.

### Claim 6 (depends on 5)

The antenna structure according to claim 5, wherein the circuit board further comprises a ground layer disposed on an upper surface of the bonding sheet.

### Claim 7 (depends on 4)

The antenna structure according to claim 4, wherein the bonding sheet has a dissipation factor (Df) of 0.003 or less at 10 GHz.

### Claim 8 (depends on 4)

The antenna structure according to claim 4, wherein the bonding sheet has a greater thickness than a thickness of the core layer.

### Claim 9 (depends on 8)

The antenna structure according to claim 8, wherein the core layer has a thickness of 20 μm or less, and the bonding sheet has a thickness of 20 μm or more.

### Claim 10 (depends on 2)

The antenna structure according to claim 2, wherein the circuit board comprises a bonding region adhered to the antenna device, a body region, and a bending region disposed between the bonding region and the body region; and
the antenna bonding area is included in the bonding region.

### Claim 11 (depends on 10)

The antenna structure according to claim 10, wherein the outer insulation layer has a greater thickness than a thickness of the circuit board in the bonding region.

### Claim 12 (depends on 10)

The antenna structure according to claim 10, further comprising an antenna driving integrated circuit chip disposed under the antenna device; and
the circuit board is bent downward to a lower side of the antenna device through the bending region, and is electrically connected to the antenna driving integrated circuit chip through the body region.

### Claim 13 (depends on 10)

The antenna structure according to claim 10, further comprising a conductive intermediate structure bonding the bonding region of the circuit board and the antenna device each other.

### Claim 14 (depends on 1)

The antenna structure according to claim 1, wherein the antenna unit comprises:
a radiator;
a transmission line connected to the radiator;
a signal pad connected to one end of the transmission line and electrically connected to the circuit board; and
ground pads disposed around the signal pad and separated from the signal pad and the transmission line.

### Claim 15 (depends on 1)

A display device comprising:
a display panel; and
the antenna structure according to claim 1 on the display panel.
