# US 12,225,660 B2 · Circuit board assembly for blocking unwanted light, camera module, and electronic device having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,225,660 B2 - Document ID: US12225660B2 - Status: Granted - Kind: B2 - Application number: 17/883,861 - Filed: 2022-08-09 - Published: 2023-12-21 - Granted: 2025-02-11 - Earliest claimed: 2022-06-10 - Assignees: Triple Win Technology(Shenzhen) Co.Ltd. - Applicants: Triple Win Technology(Shenzhen) Co.Ltd. - Inventors: Ying-Lin Chen; Chia-Weng Hsu; Ping-Liang Eng; Feng-Chang Chien - Web page: https://patentgrep.com/patent/US12225660B2 ## CPC - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - G02B 5/003: {Light absorbing elements} - G03B 30/00: Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles - H04N 23/00: Cameras or camera modules comprising electronic image sensors; Control thereof - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)} - H05K 1/0298: {Multilayer circuits} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - G03B 11/00: Filters or other obturators specially adapted for photographic purposes - H05K 2201/1009: Electromotor - H05K 2201/10151: Sensor - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module. ## Claims ### Claim 1 A circuit board assembly comprising: a circuit board defining a hole; a sensor disposed in the hole, an inner sidewall of the hole and an outer periphery of the sensor cooperatively defining a gap; and an optical blocking body disposed in the gap; wherein the circuit board comprises a base board and a photomask, the photomask is arranged on the base board, the base board comprises a plurality of conductive circuit layers and a plurality of dielectric layers, the plurality of conductive circuit layers and the plurality of dielectric layers are alternately arranged, the sensor is electrically connected to the plurality of the conductive layers, the hole penetrates the photomask, the plurality of dielectric layers, and the plurality of conductive circuit layers, the optical blocking body, the photomask, and the plurality of dielectric layers are configured to block light from an ambient environment; wherein the base board comprises a first surface, a second surface, and a plurality of side surfaces, the plurality of side surfaces connects the first surface and the second surface, the photomask is arranged on each of the first surface, the second surface, and the plurality of side surfaces. ### Claim 2 (depends on 1) The circuit board assembly of claim 1, wherein the photomask comprises a black solder mask and a black cover film, the base board defines a flexible region and a rigid region, the black solder mask is arranged on the rigid region, and the black cover film is arranged on the flexible region. ### Claim 3 (depends on 2) The circuit board assembly of claim 2, further comprising a support plate, wherein the support plate is arranged on the rigid region and covers the hole, and the optical blocking body is further disposed between the support plate and the sensor. ### Claim 4 (depends on 3) The circuit board assembly of claim 3, wherein the support plate is coated with a black coating layer. ### Claim 5 (depends on 3) The circuit board assembly of claim 3, further comprising a connector, wherein the connector is disposed on the rigid region, and the connector faces away from the support plate. ### Claim 6 (depends on 1) The circuit board assembly of claim 1, wherein a color of each of the optical blocking body, the photomask, and the plurality of dielectric layer is black. ### Claim 7 A camera module comprising: a voice coil motor; a lens assembly disposed in the voice coil motor; and a circuit board assembly connected to the voice coil motor; wherein the circuit board assembly comprises a circuit board defining a hole, a sensor disposed in the hole, and an optical blocking body, an inner sidewall of the hole and an outer periphery of the sensor cooperatively define a gap, the optical blocking body is disposed within the gap; and the circuit board comprises a base board and a photomask, the photomask is arranged on the base board, the base board comprises a plurality of conductive circuit layers and a plurality of dielectric layers, the plurality of conductive circuit layers and the plurality of dielectric layers are alternately arranged, the sensor is electrically connected to the plurality of the conductive layers, the hole penetrates the photomask, the plurality of dielectric layers, and the plurality of conductive circuit layers, the optical blocking body, the photomask, and the plurality of dielectric layers are configured to block light from an ambient environment; wherein the camera module further comprising a bracket and a filter, wherein the bracket is arranged between the voice coil motor and the circuit board assembly, the filter is disposed within the bracket, and the filter faces the lens assembly and the sensor. ### Claim 8 (depends on 7) The camera module of claim 7, wherein the base board comprises a first surface, a second surface, and a plurality of side surfaces, the plurality of side surfaces connects the first surface and the second surface, the photomask is arranged on each of the first surface, the second surface, and the plurality of side surfaces. ### Claim 9 (depends on 7) The camera module of claim 7, wherein the photomask comprises a black solder mask and a black cover film, the base board defines a flexible region and a rigid region, the black solder mask is arranged on the rigid region, and the black cover film is arranged on the flexible region. ### Claim 10 (depends on 9) The camera module of claim 9, wherein the circuit board assembly further comprises a support plate, the support plate is arranged on the rigid region and covers the hole, the optical blocking body is further disposed between the support plate and the sensor. ### Claim 11 (depends on 10) The camera module of claim 10, wherein the support plate is coated with a black coating layer. ### Claim 12 (depends on 10) The camera module of claim 10, further comprising a connector, wherein the connector is disposed on the rigid region, the connector faces away from the support plate. ### Claim 13 (depends on 7) The camera module of claim 7, wherein a color of each of the optical blocking body, the photomask, and the plurality of dielectric layer are black. ### Claim 14 An electronic device comprising: a casing defining an opening; and a camera module disposed within the casing; a portion of the camera is exposed from the opening; wherein the camera module comprising: a voice coil motor; a lens assembly disposed in the voice coil motor; and a circuit board assembly connected to the voice coil motor; the circuit board assembly comprises a circuit board defining a hole, a sensor disposed in the hole, and an optical blocking body, an inner sidewall of the hole and an outer periphery of the sensor cooperatively define a gap, the optical blocking body is disposed within the gap; the circuit board comprises a base board and a photomask, the photomask is arranged on the base board, the base board comprises a plurality of conductive circuit layers and a plurality of dielectric layers, the plurality of conductive circuit layers and the plurality of dielectric layers are alternately arranged, the sensor is electrically connected to the plurality of the conductive layers, the hole penetrates the photomask, the plurality of dielectric layers, and the plurality of conductive circuit layers, the optical blocking body, the photomask, and the plurality of dielectric layers are configured to block light from an ambient environment; wherein the camera module further comprises a bracket and a filter, wherein the bracket is arranged between the voice coil motor and the circuit board assembly, the filter is disposed within the bracket, the filter faces the lens assembly and the sensor. ### Claim 15 (depends on 14) The electronic device of claim 14, wherein the base board comprises a first surface, a second surface, and a plurality of side surfaces, the plurality of side surfaces connects the first surface and the second surface, the photomask is arranged on each of the first surface, the second surface, and the plurality of side surfaces. ### Claim 16 (depends on 14) The electronic device of claim 14, wherein the photomask comprises a black solder mask and a black cover film, the base board defines a flexible region and a rigid region, the black solder mask is arranged on the rigid region, the black cover film is arranged on the flexible region. ### Claim 17 (depends on 16) The electronic device of claim 16, wherein the circuit board assembly further comprises a support plate, the support plate is arranged on the rigid region and covers the hole, the optical blocking body is further disposed between the support plate and the sensor.