# US 12,225,659 B2 · Electronic control device

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- Number: US 12,225,659 B2
- Document ID: US12225659B2
- Status: Granted
- Kind: B2
- Application number: 17/797,000
- Filed: 2020-12-25
- Published: 2023-02-23
- Granted: 2025-02-11
- Earliest claimed: 2020-02-17
- Assignees: Hitachi Astemo, Ltd.
- Applicants: Hitachi Astemo, Ltd.
- Inventors: Miki Hiraoka; Yoshio Kawai
- Web page: https://patentgrep.com/patent/US12225659B2

## CPC

- H05K 1/0224: {Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence)}
- H10W 40/10: Arrangements for heating
- H05K 1/0206: {by printed thermal vias}
- H05K 1/0207: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes}
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- H05K 7/205: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)}
- H05K 7/20854: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence)}
- H05K 9/0039: {Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing (printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218)}
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H05K 1/181: associated with surface mounted components
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/0999: Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
- H05K 2201/10969: Metallic case or integral heatsink of component electrically connected to a pad on PCB
- H10W 40/611: {Bolts or screws}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.

## Claims

### Claim 1

An electronic control device comprising:
a housing that dissipates heat of a heat generation element; and
a board that is in contact with the housing wherein the board includes
a heat sink on which the heat generation element is mounted,
a via that penetrates the board in a thickness direction, wherein the via is in thermal contact with the housing via an insulating heat transfer portion that is an insulator,
a first layer formed on a first surface of the board that includes a first non-ground wiring that is in direct contact with the heat sink, and
a second layer that is a layer closest to the first layer in the board, wherein the second layer includes a second ground wiring that is in electrical and thermal contact with the housing,
a fourth layer formed on a second surface of the board, wherein the fourth layer includes a fourth ground wiring that is not in direct contact with the via but is in electrical and thermal contact with the housing and
a third layer that is an inner layer closest to the fourth layer, wherein the third layer includes a third non-ground wiring that is in direct contact with the via;
wherein:
a potential of the housing is a ground,
a potential of the heat sink is a non-ground,
the first non-ground wiring and the second ground wiring overlap each other in plan view from the thickness direction of the board, and
the third non-ground wiring and the fourth ground wiring overlap each other in the plan view from the thickness direction of the board.

### Claim 2 (depends on 1)

The electronic control device according to claim 1, wherein the housing is made of resin.

### Claim 3 (depends on 1)

The electronic control device according to claim 1, wherein a ratio of an area in which the first non-ground wiring and the second ground wiring overlap each other in the plan view with respect to a distance between the first non-ground wiring and the second ground wiring in the thickness direction of the board is greater than 80 mm.