# US 12,224,734 B2 · Surface acoustic wave device and method of manufacturing the same

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- Number: US 12,224,734 B2
- Document ID: US12224734B2
- Status: Granted
- Kind: B2
- Application number: 17/856,036
- Filed: 2022-07-01
- Published: 2022-10-20
- Granted: 2025-02-11
- Earliest claimed: 2019-07-10
- Assignees: Chipbond Technology Corporation
- Applicants: Chipbond Technology Corporation
- Inventors: Cheng-Hung Shih; Cheng-Fan Lin
- Web page: https://patentgrep.com/patent/US12224734B2

## CPC

- H03H 9/02952: {of parasitic capacitance}
- H03H 9/1071: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device}
- H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves
- H03H 9/02834: {of temperature influence (cut angles H03H9/02543)}
- H03H 9/02992: {Details of bus bars, contact pads or other electrical connections for finger electrodes}
- H03H 9/059: {consisting of mounting pads or bumps}
- H03H 9/145: for networks using surface acoustic waves
- H10N 30/877: {Conductive materials}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

A surface acoustic wave device includes a piezoelectric substrate, a supportive layer, a cover layer and a pillar bump. The supportive layer is disposed on the piezoelectric substrate and around a transducer, the cover layer covers the supportive layer, and the pillar bump is located in a lower via hole of the supportive layer and an upper via hole of the cover layer. The upper via hole has a lateral opening located on a lateral surface of the cover layer, and the pillar bump in the cover layer protrudes from the lateral surface of the cover layer via the lateral opening.

## Claims

### Claim 1

A method of manufacturing a surface acoustic wave device comprising:
providing a piezoelectric substrate including a base, a conductive pad and a transducer, the conductive pad and the transducer are disposed on the base and electrically connected with each other;
forming a supportive layer on the piezoelectric substrate;
patterning the supportive layer to form a lower via hole and an opening hole, the lower via hole is located outside the opening hole and exposes the conductive pad, the opening hole is located above the transducer,
wherein the patterned supportive layer surrounds the transducer;
forming a cover layer on the supportive layer, the cover layer covers the opening hole;
patterning the cover layer to form an upper via hole, the upper via hole is located above the lower via hole and communicated to the lower via hole,
wherein the upper via hole has a first top opening, a first bottom opening and a first lateral opening, the first top opening is located on a top surface of the cover layer, the first bottom opening is located on a bottom surface of the cover layer, the first lateral opening is located on a lateral surface of the cover layer, and both ends of the first lateral opening are connected to the first top opening and the first bottom opening, respectively;
forming a photoresist layer on the cover layer;
patterning the photoresist layer to form an opening, the opening is communicated to the upper via hole;
forming a pillar bump in the lower via hole and the upper via hole, the pillar bump is connected to the conductive pad; and
removing the photoresist layer;
wherein the pillar bump in the cover layer includes a first part and a second part, the first part is located in the upper via hole and the second part is protruded from the lateral surface of the cover layer via the first lateral opening of the upper via hole.

### Claim 2 (depends on 1)

The method in accordance with claim 1, wherein the pillar bump in the supportive layer includes a third part connected to the first part and a fourth part connected to the second part, the third part and the fourth part are located in the lower via hole.

### Claim 3 (depends on 1)

The method in accordance with claim 1, wherein the lower via hole has a second top opening, a second bottom opening and a second lateral opening, the second top opening is located on a top surface of the supportive layer, the second bottom opening is located on a bottom surface of the supportive layer, the second lateral opening is located on a lateral surface of the supportive layer, and both ends of the second lateral opening are connected to the second top opening and the second bottom opening, respectively.

### Claim 4 (depends on 3)

The method in accordance with claim 3, wherein the pillar bump in the supportive layer includes a third part and a fourth part, the third part is connected to the first part and located in the lower via hole, the fourth part is connected to the second part and protruded from the lateral surface of the supportive layer via the second lateral opening of the lower via hole.

### Claim 5 (depends on 1)

The method in accordance with claim 1 further comprising a step of forming a connective element on a top surface of the pillar bump, wherein the connective element is electrically connected to the conductive pad via the pillar bump.

### Claim 6 (depends on 5)

The method in accordance with claim 5 further comprising a step of reflowing the connective element after removing the photoresist layer.

### Claim 7 (depends on 1)

The method in accordance with claim 1, wherein the piezoelectric substrate further includes a protective layer which covers the transducer and has an opening exposing the conductive pad.

### Claim 8 (depends on 1)

The method in accordance with claim 1, wherein the supportive layer has a height higher than a height of the transducer.