Peeling device for resin layer coating rectangular wire

A peeling device for a resin layer coating a rectangular wire in which an outer side of a metal conductor having a rectangular shape in cross section and having chamfered corners is coated with the resin layer comprising:

• a processing blade configured to peel off the resin layer;
• a jig configured to hold the rectangular wire;
• and
• a position detector configured to detect a position of a cutting edge of the processing blade with respect to a surface of the metal conductor,
• wherein the cutting edge of the processing blade is caused to penetrate into a predetermined thickness position of the resin layer, and the processing blade and the rectangular wire are relatively moved in a longitudinal direction of the rectangular wire without contact of the cutting edge with the metal conductor to perform treatment of peeling off the resin layer, and
• wherein the processing blade includes
• a pair of upper and lower processing blades disposed to face the upper and lower surface-side coating resin layers of the rectangular wire,
• a pair of left and right processing blades disposed, behind the pair of upper and lower processing blades, to face the left and right surface-side coating resin layers of the rectangular wire, and
• four chamfered-corner processing blades disposed, behind the pair of left and right processing blades, to face chamfered-corner coating resin layers of the rectangular wire.